EPC Composite Floor Substrate Tempering for Shrinkage Control
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Solution Overview
Problem
Current manufacturing processes for EPC composite structure floors result in high heating size change rates and poor thermal resistance, failing to meet ISO standards due to damage from high-temperature tempering treatments, which affect the surface textures of the LVT layer and hinder compliance with deformation tests at elevated temperatures.
Innovation Solution
A tempering process involving sequential heat pressing at 140°C for 30 seconds and cold pressing at 20°C for 30 seconds, applied specifically to the substrate layer before attachment with the LVT layer, to control size change rates and maintain surface integrity, with optimized temperature and pressure conditions to achieve deformation resistance and low shrinkage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high-temperature tempering treatment is performed to reduce heating size change rate, then thermal resistance is improved, but the surface textures of the LVT layer are damaged
Solution Approach 1:
The substrate layer undergoes tempering treatment before being attached to the LVT layer. This preliminary action allows the substrate to stabilize its dimensions and reduce heating size change rate in advance, so that subsequent high-temperature exposure during assembly does not cause excessive deformation or damage to the LVT layer surface textures.
Solution Approach 2:
The tempering process is segmented into two distinct stages: heat pressing treatment (high temperature) followed by cold pressing treatment (low temperature). This segmentation allows the substrate layer to first undergo thermal stabilization, then dimensional consolidation, achieving both thermal resistance improvement and deformation control without damaging the LVT layer.
2Manufacturing precision
If heat pressing treatment is performed at 70°C or above during tempering, then heating size change rate is reduced, but the LVT layer is damaged
Solution Approach 1:
The substrate layer is tempered before attachment to the LVT layer, performing the high-temperature heat pressing treatment in advance when the LVT layer is not yet present. This eliminates the risk of LVT layer damage while still achieving the necessary reduction in heating size change rate through preliminary dimensional stabilization.
3Object-affected harmful factors
If heat pressing treatment is performed at 70°C or below during tempering, then LVT layer is protected, but heating size change rate cannot meet ISO standard
Solution Approach 1:
The substrate layer receives comprehensive tempering treatment (including high-temperature heat pressing) before LVT layer attachment, ensuring all necessary dimensional stabilization occurs in advance. This allows achieving ISO standard compliance for heating size change rate without exposing the LVT layer to damaging temperatures.
Solution Approach 2:
The manufacturing process is segmented into distinct phases: substrate layer preparation with full tempering treatment, followed by LVT layer attachment. This segmentation enables aggressive tempering of the substrate without compromising LVT layer integrity, as they are processed separately in sequence.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The process ensures EPC floors meet ISO standards by maintaining a heating size change rate of 0.15% or below after 6 hours at 80°C, enhancing thermal resistance and preventing damage to the LVT layer, thus achieving compliance with deformation tests.
Implementation Method 1
heat pressing treatment and cold pressing treatment which are performed sequentially in time sequence, wherein the heat pressing treatment temperature is 140° C.
Implementation Method 2
cold pressing treatment and the temperature after the cold pressing treatment is 20° C.
Implementation Method 3
the substrate layer is singly subjected to the tempering treatment... the heating size change rate of 0.15% or below after being placed in an environment of 80° C. for 6 hours
Data Source
AI summary
A manufacturing process of EPC composite structure floors which includes an LVT layer and a substrate layer from top to bottom includes steps of separately and independently preparing the LVT layer and the substrate layer, and performing stacking and attaching the LVT layer and the substrate layer with glue so as to obtain finished products of the EPC floors. The substrate layer needs to be subjected to a working procedure of tempering before being stacked and attached with the LVT layer. The EPC floors manufactured by the process completely meet ISO standard requirements, and when being maintained in an environment of 80° C. for 6 hours, the WPC floors can also maintain a size change rate of 0.15% or below.