Segmented EPI Chamber Body With Inject Ring and Base Plate
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Solution Overview
Problem
Existing semiconductor processing chamber bodies have high replacement costs, limiting rapid innovation and change in design due to their singular nature, which affects temperature distribution, precursor flow, and throughput.
Innovation Solution
A segmented chamber body design comprising a base plate and an inject ring, allowing for cost-effective replacement and improvement of gas flow paths, thermal distribution, and integration with existing elements, featuring annular openings and purge gas passages for enhanced processing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a singular chamber body design is used, then structural simplicity is maintained, but replacement cost increases and design flexibility decreases
Solution Approach 1:
The chamber body is divided into multiple separable components: a base plate assembly and an inject ring assembly. The base plate assembly includes a base plate with substrate transfer passages and exhaust passages, while the inject ring assembly includes an inject ring with gas inject passages. This segmentation allows individual components to be replaced independently, reducing replacement costs and enabling design flexibility without requiring replacement of the entire chamber body.
2Adaptability or versatility
If a segmented chamber body design is implemented, then component replacement cost decreases and design flexibility increases, but sealing complexity increases
Solution Approach 1:
The chamber body is segmented into replaceable modules (base plate assembly and inject ring assembly) connected through standardized sealing interfaces. This allows design flexibility and easy replacement while containing sealing complexity to specific standardized locations.
Solution Approach 2:
Sealing rings serve as intermediary elements between the base plate assembly and inject ring assembly. These sealing rings are positioned in sealing grooves and provide the necessary seal without requiring complex integrated sealing structures, simplifying the overall sealing system while enabling component separation.
3Manufacturing precision
If heating lamps are disposed below and above the substrate, then temperature control precision improves, but energy consumption increases
Solution Approach 1:
Heating lamps are strategically positioned both below and above the substrate to create localized heating zones. This allows different regions of the substrate to receive appropriate heating, improving temperature uniformity across the substrate surface while optimizing energy distribution rather than uniform heating of the entire chamber.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The segmented design reduces maintenance and replacement costs while improving gas flow and thermal consistency, enabling more efficient semiconductor processing without requiring full chamber replacement.
Implementation Method 1
Precise control over a heating source, such as a plurality of heating lamps disposed below and above the substrate, allows the substrate to be heated within very strict tolerances.
Implementation Method 2
A segmented chamber body design comprising a base plate and an inject ring with annular openings and gas inject passages, allowing for horizontal gas flow across substrates
Data Source
AI summary
An apparatus as disclosed herein relates to a chamber body design for use within a thermal deposition chamber, such as an epitaxial deposition chamber. The chamber body is a segmented chamber body design and includes an inject ring and a base plate. The base plate includes a substrate transfer passage and one or more exhaust passages disposed therethrough. The inject ring includes a plurality of gas inject passages disposed therethrough. The inject ring is disposed on top of the base plate and attached to the base plate. The one or more exhaust passages and the gas inject passages are disposed opposite one another. One or more seal grooves are formed in both the base plate and the inject ring to enable the inject ring and the base plate to seal to one another as well as other components within the process chamber.