Integrated EPIC Architecture With Interposer-Based EIC–PIC Coupling
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Solution Overview
Problem
Forming connections between substrates of electronic integrated circuits (EICs) and photonic integrated circuits (PICs) poses challenges, affecting computational power and integration efficiency.
Innovation Solution
A hybrid transceiver system is developed, comprising a support base with a redistribution layer (RDL) and connecting elements that couple EICs and PICs, allowing for optical and electrical signal transmission, with v-grooves and optical couplers for fiber connection, and embedded EICs for control electronics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If connections are formed between substrates of EICs and PICs to increase computational power, then computational power is improved, but packaging complexity and manufacturing difficulty increase
Solution Approach 1:
The system is divided into separate functional modules including EIC substrates, PIC substrates, interposer substrates, and support bases. Each module can be independently manufactured and tested before final assembly, reducing overall packaging complexity while maintaining high computational power through modular integration.
Solution Approach 2:
An interposer substrate is introduced as an intermediary component between EIC and PIC substrates. This interposer provides standardized connection interfaces and signal routing, simplifying the direct integration process and reducing manufacturing difficulty while enabling high-speed optical-electrical signal transmission.
2Power
If multiple integrated circuits are integrated into a single unit to improve computational power, then computational power is improved, but manufacturing precision requirements increase
Solution Approach 1:
Alignment marks and positioning structures are pre-formed on substrates during fabrication. The interposer substrate includes pre-configured connection pads and routing patterns that guide subsequent assembly steps, ensuring precise alignment between EIC and PIC components without requiring ultra-precision real-time alignment during packaging.
Solution Approach 2:
The interposer substrate acts as a buffer layer that absorbs and compensates for dimensional variations and thermal expansion differences between EIC and PIC substrates. This intermediary layer provides a stable mounting platform that maintains alignment precision during assembly and operation.
3Productivity
If optical fibers are coupled to PICs with output ports extending beyond support base to enable signal transmission, then signal transmission capability is improved, but device structure complexity increases
Solution Approach 1:
Optical fibers are routed through vertical channels and vias in the support base structure, transitioning from horizontal to vertical routing. This three-dimensional fiber routing approach allows output ports to extend beyond the support base while maintaining a compact footprint and reducing the number of lateral connections required.
Solution Approach 2:
Optical fibers are nested within protective channels and conduits formed in the support base structure. The fibers are embedded within layers of encapsulant material and protected by structural features, creating a compact nested arrangement that reduces structural complexity while enabling efficient signal transmission.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances computational power and integration efficiency by enabling effective optical and electrical signal transmission between EICs and PICs, facilitating advanced computational tasks.
Implementation Method 1
The optical coupler may be a plug connect to receive an optical fiber in a direction parallel with the first layer
Implementation Method 2
The output port may include one or more v-grooves extending in a direction parallel to the first layer
Implementation Method 3
A redistribution layer may be arranged between the connecting element, the first compute device and the photonic integrated circuit
Data Source
AI summary
Disclosed herein are systems, methods and device including a first layer with a photonic integrated circuit and a first compute device, the photonic integrated circuit having an output port coupled to an optical fiber, the first layer may be positioned on a support base in a second layer, while a connecting element may couple the photonic integrated circuit and the first compute device. The output port may extend in a direction parallel with the first layer beyond the support base.