Epitaxial Layer Composition Matching for Defect-Free Thick Growth
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Solution Overview
Problem
Thick epitaxially grown layers on engineered substrates with significant thermal expansion coefficient differences between the handle substrate and crystalline seed layer lead to strain and relaxation defects, which can propagate through the layer, deteriorating device performance.
Innovation Solution
Selecting the composition of the second crystalline semiconductor layer to match the lateral lattice constant of the strained top layer at growth temperature, ensuring the layer is essentially unstrained, thereby preventing relaxation defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thick epitaxial layers are grown on engineered substrates with large thermal expansion coefficient differences, then the substrate integration benefits are achieved, but strain and relaxation defects propagate through the layer
Solution Approach 1:
The invention changes the compositional parameters of the epitaxial layer to match the lateral lattice constant of the strained seed layer at growth temperature. This parameter adjustment eliminates the strain that would otherwise propagate through thick layers, allowing reliable device performance without relaxation defects.
Solution Approach 2:
The invention applies a specific compositional gradient or localized composition adjustment in the epitaxial layer to match the strained lattice constant of the seed layer. This local quality adjustment ensures that the interface region accommodates the strain while the bulk layer can grow thick without defects.
2Manufacturing precision
If the grown layer has the same free-standing lateral lattice constant as the seed layer, then lattice matching is achieved, but the layer becomes strained at growth temperature due to thermal expansion differences
Solution Approach 1:
The invention adjusts the compositional parameters of the epitaxial layer so that its free-standing lateral lattice constant at growth temperature matches the strained seed layer's lateral lattice constant. This compensates for thermal expansion differences and eliminates strain while maintaining lattice matching.
Solution Approach 2:
The invention considers the temperature dimension when matching lattice constants. By matching the lateral lattice constant at growth temperature rather than at room temperature, the solution accounts for thermal expansion effects and eliminates strain in the grown layer.
3Reliability
If the composition of subsequent layers is selected to match the previous layer's lateral lattice constant at growth temperature, then relaxation defects are prevented, but composition adjustments are required for each layer
Solution Approach 1:
The invention establishes a systematic approach to compositional parameter selection for each epitaxial layer based on the previous layer's strained lattice constant at growth temperature. This methodical parameter adjustment ensures defect-free thick layers while providing a repeatable process for multi-layer structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables growth of layers beyond critical thickness without relaxation defects, improving device performance and longevity by maintaining lattice matching.
Implementation Method 1
a second crystalline semiconductor layer is produced by epitaxial growth on said top layer
Implementation Method 2
The thermal expansion coefficients of the handle substrate and the top layer are significantly different from each other, so that the top layer is strained at the growth temperature
Data Source
Figure 1~2b
Figure 3
Figure 4
AI summary
On an engineered substrate (1) comprising a handle substrate (2), and a crystalline semiconductor top layer (4) bonded to the handle substrate (2), a second crystalline semiconductor layer (10) is produced by epitaxial growth on said top layer (4). The thermal expansion coefficients of the handle substrate and the top layer are significantly different from each other, so that the top layer is strained at the growth temperature. The composition of the second layer (10) is selected so that at said growth temperature, the second layer is essentially unstrained. This enables growing a device stack with the second layer forming the bottom layer of said stack, and wherein said bottom layer (10) can be grown above a critical thickness without exhibiting relaxation defects. This is true also for subsequent layers (101-105;201-206) of the stack, especially for layers exceeding a critical thickness, by selecting the composition of said layers in the same way as the bottom layer.