Epitaxial Die Transfer for Precise Light-Emitting Display Assembly
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Solution Overview
Problem
The manufacturing process of display panels with light emitting elements is inefficient, leading to high costs and potential alignment errors in forming light emitting elements.
Innovation Solution
A method involving the creation of epitaxial wafers, division into wafer dies, transfer to a carrier substrate, bonding onto a backplane substrate, and etching to form light emitting elements, which enhances manufacturing efficiency and reduces costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional manufacturing methods are used for display panels with light emitting elements, then the process is simpler, but manufacturing efficiency is low and costs are high
Solution Approach 1:
The patent divides the epitaxial wafer into multiple wafer dies, each corresponding to a cell area of the backplane substrate. This segmentation allows parallel processing and transfer of multiple light emitting element groups simultaneously, significantly improving manufacturing efficiency while managing complexity through modular operations
Solution Approach 2:
The patent performs preliminary actions by forming the conductive bonding layer on the wafer dies before transfer, and preparing the backplane substrate with pixel electrodes in advance. These preliminary preparations enable efficient bonding and assembly operations, improving overall manufacturing efficiency without proportionally increasing process complexity
2Loss of substance
If wafer substrates are used more efficiently, then manufacturing costs are reduced, but alignment precision requirements increase
Solution Approach 1:
The patent replaces mechanical alignment methods with optical alignment by forming a conductive bonding layer with reflective properties. The reflective layer enables optical detection and precise alignment of wafer dies with pixel electrodes, achieving high alignment precision while maximizing wafer substrate utilization and reducing manufacturing costs
3Manufacturing precision
If light emitting elements are formed with high precision, then product quality improves, but manufacturing time increases
Solution Approach 1:
The patent segments the manufacturing process into parallel operations: multiple wafer dies are prepared, transferred, and bonded simultaneously. This segmentation maintains high precision light emitting element formation while reducing total manufacturing time through concurrent processing of multiple cell areas
Solution Approach 2:
The patent performs preliminary formation of conductive bonding layers and pixel electrode preparations before the actual light emitting element assembly. These preliminary actions are conducted in advance and in parallel, enabling high-precision element formation to proceed faster without compromising quality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method increases the use efficiency of wafer substrates, reduces manufacturing costs, simplifies the process, and minimizes alignment errors, thereby improving the overall efficiency and yield of display panels and devices.
Implementation Method 1
the epitaxial dies may be bonded onto the backplane substrate by a transient liquid phase (TLP) bonding method or a thermal compression (TC) bonding method
Implementation Method 2
the epitaxial dies may be bonded onto the backplane substrate by a transient liquid phase (TLP) bonding method or a thermal compression (TC) bonding method
Implementation Method 3
the carrier substrate may be removed from the epitaxial dies by a laser lift off (LLO) method
Implementation Method 4
etching the epitaxial dies to form respective light emitting elements in emission areas included in each cell area of the backplane substrate
Data Source
AI summary
A method for manufacturing a display device includes manufacturing an epitaxial wafer including an epitaxial thin film, dividing the epitaxial wafer into wafer dies having a size corresponding to an area of each cell area of a backplane substrate including cell areas, transferring the wafer dies to a carrier substrate, forming a conductive bonding layer on epitaxial dies of the wafer dies, disposing the carrier substrate on the backplane substrate such that the epitaxial dies are disposed in each cell area of the backplane substrate and bonding the epitaxial dies onto the backplane substrate, removing the carrier substrate from the epitaxial dies, and etching the epitaxial dies to form respective light emitting elements in emission areas included in each cell area of the backplane substrate.