Epitaxial Growth Reactor Loading Mechanism

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Solution Overview

Problem

The challenge in epitaxial growth reactors is the difficulty in efficiently loading and unloading substrates at high temperatures while ensuring the integrity of the grown layers, particularly for silicon carbide, due to the need for precise handling and the combination of loading/unloading with growth processes.

Innovation Solution

A reaction chamber design with a susceptor and supporting element system, along with a loading/unloading device, allows for the handling of substrates at high temperatures by manipulating the supporting element rather than the substrates directly, using heat insulating materials and a specific configuration of flat and curved walls to maintain temperature consistency and facilitate safe handling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If substrates are loaded and unloaded at low temperature, then substrate handling is easier and safer, but the reactor must wait for heating and cooling cycles which reduces productivity

Engineering Contradiction:
Improvesubstrate handlingVSAvoidreactor productivity
Core Design Contradiction:
Ease of operationVSProductivity

Solution Approach 1:

The reaction chamber is segmented into a high-temperature growth zone and a low-temperature loading/unloading zone. The support device with susceptor and supporting element allows substrate handling to occur in the low-temperature zone while growth occurs in the high-temperature zone, enabling simultaneous operations without thermal coupling.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A support device acting as an intermediary carries substrates between the loading/unloading device and the growth zone. The support device with susceptor and supporting element can be heated to growth temperature and then used to transfer substrates to the low-temperature zone for handling, eliminating the need to heat/cool the entire chamber.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Productivity

If substrates are handled at high temperature, then loading/unloading time is reduced and productivity improves, but substrate damage risk increases due to difficulty in handling

Engineering Contradiction:
Improveloading/unloading speedVSAvoidsubstrate integrity
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The handling process is segmented into two distinct thermal environments: substrates are loaded/unloaded at low temperature where handling is safe and easy, then the support device with susceptor and supporting element rapidly transports them to the high-temperature growth zone. This spatial-temporal segmentation allows both safe handling and rapid processing.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The support device with susceptor and supporting element is pre-heated to growth temperature before substrate transfer. This preliminary heating of the support structure allows immediate placement of substrates into the growth zone without thermal shock or waiting time, maintaining substrate integrity while enabling rapid processing.

Inventive Principle:
Principle #10Preliminary action

3Productivity

If a loading/unloading device is added to enable high-temperature handling, then productivity improves, but device complexity increases

Engineering Contradiction:
Improvereactor productivityVSAvoidchamber configuration
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The support device with susceptor and supporting element serves multiple functions: it supports substrates during loading/unloading, transports them between zones, maintains them at growth temperature during transfer, and positions them in the growth zone. This multi-functionality consolidates what could be multiple separate systems into a single integrated mechanism.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The loading/unloading device is merged with the support device and susceptor system into an integrated assembly. The supporting element on the susceptor combines substrate support, thermal management, and positioning functions, reducing the number of separate components and simplifying the overall system architecture.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables efficient loading and unloading of substrates at very high temperatures, ensuring the integrity of the grown layers and improving reactor productivity by decoupling the handling process from the growth process, thus enhancing epitaxial growth performance.

Implementation Method 1

using heat insulating materials and a specific configuration of flat and curved walls to maintain temperature consistency and facilitate safe handling

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS10392723B2Reaction chamber for epitaxial growth with a loading/unloading device and reactor
Publication Date: 2019.08.27 LPE SPA
  • US10392723B2 patent drawing
  • US10392723B2 patent drawing
  • US10392723B2 patent drawing

AI summary

A reaction chamber of a reactor for epitaxial growth includes a wall (1) with a recess and a susceptor (7) comprising a body and a relief. The body is placed in said recess in a rotational manner with respect to said wall (1). The chamber includes a discoid supporting element (8), having a shape adapted to be laid stably on said relief, having a size such to protrude radially from said relief and adapted to support one or more substrates to be subjected to epitaxial growth. The chamber also includes a flat covering (91, 92) located over said wall (1) and a hole (10) at said discoid supporting element (8). The shape of said hole (10) corresponds to the shape of said discoid supporting element (8). The covering (92) has at least one hollow guide (11, 12) for the passage of a device (16) for loading/unloading said discoid supporting element (8), wherein said hollow guide (11, 12) extends from an edge of said covering (92) to said hole (10).