Expitaxial semiconductor/superconductor heterostructures

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Solution Overview

Problem

Current technologies face challenges in achieving successful epitaxial integration of semiconductor and superconducting nitride families, which is crucial for advancing applications in ultrafast microwave communications, low-power computation, and quantum information systems.

Innovation Solution

The integration involves epitaxially growing a layer of superconductor material, such as TiNx or NbNx, on a crystalline high thermal conductivity substrate, followed by layers of semiconducting or insulating materials like Group III-Nitride or SiC, enabling the formation of crossbar arrays of Josephson junctions and other devices.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If epitaxial integration of semiconductor and superconducting nitride families is attempted, then device functionality for quantum information systems is improved, but manufacturing complexity increases

Engineering Contradiction:
Improvedevice functionalityVSAvoidmanufacturing complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent combines semiconductor and superconducting nitride families into a single epitaxial heterostructure, merging two previously separate material systems into one integrated platform that enables both semiconductor and superconductor device functionalities on the same substrate

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The invention uses composite material structures consisting of multiple nitride layers (such as GaN, AlN, InN) combined with superconducting nitride layers (such as NbNx, TaNx) to create a heterostructure that exhibits both semiconductor and superconducting properties

Inventive Principle:
Principle #40Composite materials

2Reliability

If multiple layers of semiconducting and superconducting materials are epitaxially grown, then device performance is improved, but manufacturing precision requirements increase

Engineering Contradiction:
Improvedevice performanceVSAvoidepitaxial growth precision
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent employs precise control of epitaxial growth parameters including temperature, pressure, gas flow rates, and precursor ratios to achieve the required manufacturing precision for multiple layered nitride structures with controlled thicknesses and compositions

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The invention uses buffer layers and transition layers as intermediaries between different nitride material systems, facilitating the epitaxial growth interface and reducing lattice mismatch effects that would otherwise compromise manufacturing precision

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for the creation of high-quality devices with superconducting phase transitions and reduced energy loss, enabling advanced applications in quantum information systems and ultrafast electronics.

Implementation Method 1

the superconductor material being one of TiNx, ZrNx, HfNx, VNx, NbNx, TaNx, MoNx, TaNx, or alloys thereof

Methodology Applied
Scientific EffectSuperconductivity: Superconductivity

Implementation Method 2

A layer of a superconductor material epitaxially grown on a crystalline high thermal conductivity substrate, one or more layers of a semiconducting or insulating or metallic material epitaxially grown on the layer of superconductor material

Methodology Applied
Scientific EffectEpitaxy: Epitaxy

Data Source

PatentUS12161052B2Expitaxial semiconductor/superconductor heterostructures
Publication Date: 2024.12.03 THE GOVERNMENT OF THE UNITED STATES REPRESENTED BY USNAVY
  • US12161052B2 patent drawing
  • US12161052B2 patent drawing
  • US12161052B2 patent drawing

AI summary

Solid-state devices including a layer of a superconductor material epitaxially grown on a crystalline high thermal conductivity substrate, the superconductor material being one of TiNx, ZrNx, HfNx, VNx, NbNx, TaNx, MoNx, WNx, or alloys thereof, and one or more layers of a semiconducting or insulating or metallic material epitaxially grown on the layer of superconductor material, the semiconducting or insulating material being one of a Group III N material or alloys thereof or a Group 4b N material or SiC or ScN or alloys thereof.