Epitaxial Oxide FET Structures for High Breakdown Voltage

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Solution Overview

Problem

Current semiconductor devices, such as UV LEDs and high-power RF switches, face limitations in achieving high breakdown voltages and efficient electrical-to-optical energy conversion due to the use of low bandgap semiconductors.

Innovation Solution

The development of epitaxial oxide materials and structures, including superlattices and chirp layers, which are integrated into semiconductor devices to enhance their electrical and optical properties, such as increased bandgaps and improved carrier multiplication mechanisms.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If low bandgap semiconductors are used in semiconductor devices, then device complexity is reduced, but breakdown voltage is limited

Engineering Contradiction:
Improvebreakdown voltageVSAvoiddevice complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent employs composite material structures including heteroepitaxial growth of wide bandgap oxide semiconductors (such as Ga2O3, ZnO) combined with conventional semiconductors. These composite structures enable high breakdown voltage characteristics while maintaining manageable device complexity through systematic integration of different material systems with complementary properties.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent segments the semiconductor device into multiple functional layers with distinct bandgap characteristics. By dividing the device structure into regions with different semiconductor materials (wide bandgap for high voltage blocking, narrow bandgap for carrier injection), the device achieves high breakdown voltage without requiring the entire structure to be complex.

Inventive Principle:
Principle #1Segmentation

2Loss of energy

If low bandgap semiconductors are used, then manufacturing is easier, but electrical-to-optical energy conversion efficiency is reduced

Engineering Contradiction:
Improveelectrical-to-optical energy conversion efficiencyVSAvoidease of manufacture
Core Design Contradiction:
Loss of energyVSEase of manufacture

Solution Approach 1:

The patent applies local quality by assigning different semiconductor materials to specific regions based on their optimal properties. Wide bandgap materials are positioned in regions requiring high efficiency electrical-to-optical conversion, while conventional materials are used in regions where ease of manufacture and carrier injection are priorities. This spatial differentiation of material properties maximizes overall conversion efficiency without sacrificing manufacturability.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

These epitaxial oxide materials and structures enable the creation of semiconductor devices with higher breakdown voltages and improved efficiency in electrical-to-optical energy conversion, facilitating applications in UV LEDs and high-power RF switches.

Implementation Method 1

one or more epitaxial oxide layers formed on a compatible substrate with in-plane lattice parameters and atomic positions that provide a suitable template for the growth of the epitaxial oxide materials

Methodology Applied
Scientific EffectEpitaxy: Epitaxy

Implementation Method 2

one or more of the epitaxial oxide materials is strained

Methodology Applied
Scientific EffectStrain: Deformation

Data Source

PatentUS12206048B2Epitaxial oxide materials, structures, and devices
Publication Date: 2025.01.21 SILANNA UV TECH PTE LTD
  • US12206048B2 patent drawing
  • US12206048B2 patent drawing
  • US12206048B2 patent drawing

AI summary

The present disclosure provides techniques for epitaxial oxide materials, structures and devices. In some embodiments, an integrated circuit includes a field effect transistor (FET) and a waveguide coupled to the FET, wherein the waveguide comprises a signal conductor. The FET can include: a substrate comprising a first oxide material; an epitaxial semiconductor layer on the substrate, the epitaxial semiconductor layer comprising a second oxide material with a first bandgap; a gate layer on the epitaxial semiconductor layer, the gate layer comprising a third oxide material with a second bandgap, wherein the second bandgap is wider than the first bandgap; and electrical contacts. The electrical contacts can include: a source electrical contact coupled to the epitaxial semiconductor layer; a drain electrical contact coupled to the epitaxial semiconductor layer; and a first gate electrical contact coupled to the gate layer.