Epitaxial Growth Parameter Selection Using Precomputed Response Functions
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Solution Overview
Problem
The existing methods for determining process parameters in epitaxial growth systems are time-consuming and costly, requiring extensive data collection and analysis, which leads to significant errors due to changes in environment and system conditions, making them impractical for large-scale production line maintenance.
Innovation Solution
A parameter determination device, method, and program that compute appropriate values for epitaxial growth system parameters by using an input unit to accept parameter values, position data, and characteristic data, and a computation unit to derive a response function that minimizes film thickness deviation within a predetermined range, allowing for quick and cost-effective adjustments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If multiple regression analysis is used to compute influence coefficients based on past film thickness adjustment results, then the film thickness distribution can be predicted, but the computation is time-consuming and requires a large number of data points collected over long periods
Solution Approach 1:
The patent pre-calculates and stores response functions that represent the relationship between process parameters and film thickness distribution before actual production. These pre-computed response functions eliminate the need for time-consuming multiple regression analysis during parameter determination, allowing rapid prediction of film thickness distribution while maintaining accuracy.
Solution Approach 2:
The patent accumulates and stores response function data in advance under various process conditions. This pre-prepared data serves as a cushion that can be quickly referenced during parameter determination without requiring real-time computation, thus resolving the contradiction between prediction accuracy and determination time.
2Adaptability or versatility
If data collected over long periods is used for analysis, then more comprehensive process variations are covered, but the data includes variations from different environments and maintenance states that introduce large error margins
Solution Approach 1:
The patent segments the data storage by creating separate response function datasets for different process conditions, maintenance states, and environmental configurations. This segmentation allows selection of only the relevant data subset that matches current system conditions, eliminating erroneous data from unrelated states while maintaining comprehensive coverage of actual operating scenarios.
Solution Approach 2:
The patent introduces condition identification parameters (such as maintenance state flags, environment identifiers, and system configuration markers) to categorize and filter data. By changing how data is organized and selected based on these parameters, the system achieves both comprehensive process coverage and high prediction accuracy by excluding irrelevant data.
3Manufacturing precision
If process parameters are adjusted based on experience through test deposition and fine adjustment, then the film thickness distribution can be optimized, but the process is time-consuming and costly especially when performed at every maintenance point or product changeover
Solution Approach 1:
The patent implements a feedback mechanism where the measured film thickness distribution from previous runs is automatically fed into the parameter determination system. The system uses this feedback along with stored response functions to compute optimal parameters without requiring manual test depositions, thus maintaining manufacturing precision while dramatically improving adjustment efficiency.
Solution Approach 2:
The system performs automatic parameter determination using stored response functions and measured data, eliminating the need for operator intervention in test depositions and fine adjustments. The system serves itself by automatically computing optimal parameters based on objective data rather than subjective experience, improving both efficiency and consistency.
4Adaptability or versatility
If conventional experience-based parameter adjustment is used, then flexibility in adapting to different products and quality targets is maintained, but the process requires significant time and resources for each adjustment cycle
Solution Approach 1:
The patent pre-computes response functions for multiple product types and quality targets during system setup. When a product changeover is needed, the system simply selects the appropriate pre-computed response functions rather than performing new computations or test depositions, thus maintaining adaptability while minimizing reconfiguration time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables rapid and cost-effective derivation of optimal parameter values, reducing the time and effort required for maintaining epitaxial growth systems and ensuring consistent film thickness distribution, even under changing conditions.
Implementation Method 1
the influence coefficient can be obtained by performing multiple regression analysis to minimize the film thickness deviation for each portion of the target wafer on the basis of past film thickness adjustment results
Implementation Method 2
In the epitaxial growth process as one of the semiconductor wafer processing processes to deposit an epitaxial film on a substrate, as shown in FIG. 1, a substrate is placed on a susceptor 13 provided in a chamber 10 of an epitaxial growth system, reaction gas is introduced into the chamber 10 and heated to form an epitaxial film on the substrate
Implementation Method 3
reaction gas is introduced into the chamber 10 and heated to form an epitaxial film on the substrate
Data Source
AI summary
A parameter determination device, a parameter determination method, and a parameter determination program for computing selected values of one or more parameters for an epitaxial growth system in a short time and at low costs are provided. The device includes an input unit that accepts a plurality of values for each of one or more parameters, position data of an epitaxial film, and characteristic data measured by a characteristic measurement device for a deposited epitaxial film; and a computation unit that computes a selected value of each of the one or more parameters from the position data, the characteristic data, and the values for each of the one or more parameters. The computation unit derives the response function FQj(x, ΔPk) to compute the selected value of the one or more parameters by simulation.