Epoxy Compound Acid Diffusion Control in Lithography Resist
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Solution Overview
Problem
Current resist compositions for ArF, EB, and EUV lithography face challenges in achieving low acid diffusion while maintaining high sensitivity, leading to inadequate control over line width roughness (LWR) and pattern profile quality.
Innovation Solution
Incorporating a specific epoxy compound with a quadri-cyclic fused ring skeleton and acid labile alkoxycarbonyl group into the resist composition, which controls acid diffusion length and enhances sensitivity, thereby improving LWR and pattern precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the structure of acid generator is modified to low acid diffusion design (higher molecular weight), then acid diffusion length is reduced, but sensitivity is lowered and solvent solubility deteriorates
Solution Approach 1:
The patent introduces a specific epoxy compound as an intermediary substance that mediates between the acid generator and the base polymer. This epoxy compound has a molecular structure containing both an epoxy group and a tertiary hydrocarbon group, which allows it to interact with both components. The epoxy compound acts as a bridge that enables low acid diffusion without requiring high molecular weight acid generators, thus maintaining sensitivity while controlling acid diffusion length.
Solution Approach 2:
The patent changes the chemical parameters of the resist composition by introducing the epoxy compound with specific structural parameters (epoxy group, tertiary hydrocarbon group with 4-20 carbon atoms). This parameter change allows the system to achieve low acid diffusion through chemical interaction rather than relying on high molecular weight, thereby avoiding the sensitivity loss associated with high molecular weight acid generators.
2Manufacturing precision
If quenchers like amine compounds are added to control acid diffusion, then acid diffusion length is reduced, but sensitivity of resist material is lowered
Solution Approach 1:
The epoxy compound serves as an alternative intermediary that replaces traditional quenchers like amine compounds. Instead of using quenchers that directly neutralize acid and reduce sensitivity, the epoxy compound provides a different mechanism through its specific molecular structure that controls acid diffusion while preserving the acid's effectiveness in the exposed regions, thus maintaining sensitivity.
Solution Approach 2:
The patent changes the approach from adding quenchers (changing composition parameters) to introducing an epoxy compound with specific structural parameters. This parameter change shifts the mechanism from acid neutralization to acid diffusion control through molecular interaction, thereby maintaining sensitivity while achieving the desired acid diffusion length control.
3Manufacturing precision
If acid diffusion is reduced to improve LWR, then line width roughness is reduced, but pattern profile quality and sensitivity are compromised
Solution Approach 1:
The epoxy compound acts as a mediator that enables precise control of acid diffusion length, which directly improves LWR. By controlling how far the acid diffuses from the exposed regions, the epoxy compound ensures sharp pattern boundaries and reduced line width roughness while maintaining the acid's effectiveness in creating proper pattern profiles through its interaction with the base polymer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The epoxy compound effectively reduces LWR and maintains high sensitivity, enabling precise micropatterning in ArF, EB, and EUV lithography processes.
Implementation Method 1
Upon light exposure, the acid generator generates an acid, which reacts with the base polymer
Implementation Method 2
it is possible to adequately control the diffusion length of generated acid
Data Source
AI summary
An epoxy compound of formula (1) is provided. A resist composition comprising the epoxy compound is capable of adequately controlling the diffusion length of acid generated from an acid generator without sacrificing sensitivity.