Epoxy-Acrylic Adhesive for Semiconductor Thermal Management
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Solution Overview
Problem
Common resins used in semiconductor manufacturing apparatuses, such as epoxy adhesives, exhibit insufficient heat resistance and are prone to warping or breaking due to high modulus of elasticity, and issues with gas generation during curing, especially under thermal cycles.
Innovation Solution
A thermosetting sheet made of a cured epoxy-acrylic adhesive containing an epoxy resin capable of hydrogen transfer type polyaddition, an acrylate or methacrylate polymer, and a curing agent, which provides improved heat resistance and stability by minimizing low-molecular substance production during curing, thereby bonding ceramic and metal components effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If high-temperature epoxy adhesive sheets are used to bond ceramic and metal components, then heat resistance is improved, but the electrostatic chuck and cooling plate warp or break due to high modulus of elasticity
Solution Approach 1:
The patent changes the chemical composition parameters of the adhesive by incorporating specific rubber components (polybutadiene or styrene-butadiene rubber) into the epoxy adhesive system. This compositional parameter change reduces the modulus of elasticity while maintaining heat resistance, preventing warping and breaking of bonded components during thermal cycling.
Solution Approach 2:
The patent creates a composite adhesive material by combining epoxy resin with rubber components (polybutadiene or styrene-butadiene rubber). This composite formulation achieves both heat resistance from the epoxy and flexibility from the rubber, resolving the contradiction between heat resistance and structural integrity.
2Strength
If epoxy adhesive sheets with low modulus of elasticity are used to prevent warping, then structural integrity is improved, but gas is generated during curing
Solution Approach 1:
The patent modifies the chemical composition by selecting specific rubber components (polybutadiene or styrene-butadiene rubber) with appropriate molecular structures that minimize volatile content. This parameter change reduces gas generation during curing while maintaining the low modulus of elasticity needed to prevent warping.
Solution Approach 2:
The patent applies the adhesive with controlled local properties by regulating the rubber content (5-50 wt%) to achieve optimal balance between flexibility and gas generation. The local composition is optimized to prevent warping in critical areas while minimizing gas generation during curing.
3Ease of manufacture
If common resins are used for bonding, then ease of manufacture is improved, but heat resistance is insufficient at 100° C.
Solution Approach 1:
The patent uses a composite adhesive material combining epoxy resin (providing heat resistance) with rubber components (providing flexibility and processability). This composite maintains ease of manufacture through simple mixing and curing processes while achieving heat resistance above 100° C.
Solution Approach 2:
The patent adjusts the compositional parameters of the adhesive by incorporating 5-50 wt% rubber content, which modifies the curing characteristics and thermal properties. This parameter change enables the adhesive to maintain ease of application and curing while achieving heat resistance suitable for semiconductor manufacturing equipment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures high-temperature resistance, maintaining shear strength, thermal conductivity, and modulus of elasticity within acceptable ranges even after prolonged thermal exposure, preventing warping and gas leaks, and ensuring reliable operation in semiconductor manufacturing equipment.
Implementation Method 1
an epoxy resin capable of hydrogen transfer type polyaddition
Implementation Method 2
an acrylate or methacrylate polymer
Implementation Method 3
a metallic cooling plate for supporting the electrostatic chuck and releasing generated heat
Data Source
AI summary
A member for semiconductor manufacturing apparatuses, which includes a ceramic electrostatic chuck and a cooling plate bonded together with a thermosetting sheet, is provided. The thermosetting sheet is made of a cured epoxy-acrylic adhesive. The adhesive contains (A) an epoxy resin capable of hydrogen transfer type polyaddition, (B) an acrylate or methacrylate polymer, and (C) a curing agent.