Epoxy Adhering Composition for Inlay Substrate Heat Dissipation
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Solution Overview
Problem
Existing methods for manufacturing inlay substrates with heat dissipation materials are costly and prone to adhesion issues, leading to heat dissipation material falling out due to lack of pressure.
Innovation Solution
An inlay substrate with a heat dissipation material coated in an adhering composition containing epoxy resin, a curing agent, and inorganic fillers, which provides stable adhesion by ensuring the material adheres effectively to the substrate during the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual pressure application method is used to fix heat dissipation material, then adhesion can be achieved, but manufacturing cost increases and adhesion stability is poor
Solution Approach 1:
An adhering composition is introduced as an intermediary substance between the heat dissipation material and the substrate. This composition includes a resin component, curing agent, and inorganic filler, forming a adhesive layer that chemically bonds both surfaces together, replacing the need for manual pressure application and providing stable adhesion.
Solution Approach 2:
The adhering composition undergoes parameter changes through curing process. The resin component transitions from a liquid or semi-liquid state to a solid state through curing, changing its physical properties from flowable to rigid, thereby providing strong and stable adhesion between the heat dissipation material and substrate.
2Manufacturing precision
If manual work method is used for inserting heat dissipation material, then positioning can be achieved, but productivity decreases and cost increases
Solution Approach 1:
The adhering composition is applied to the heat dissipation material or substrate surface in advance, before the actual insertion process. This preliminary coating ensures that when the material is inserted, adhesion immediately begins, allowing for automated insertion processes while maintaining positioning accuracy and improving productivity.
3Reliability
If pressure is not applied sufficiently during fixation, then manufacturing process is simple, but heat dissipation material falls out due to poor adhesion
Solution Approach 1:
The mechanical pressure application system is replaced with a chemical bonding system. Instead of relying on continuous mechanical pressure to maintain adhesion, the adhering composition creates chemical bonds between surfaces, eliminating the need for complex pressure application and maintenance equipment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures stable adhesion of the heat dissipation material to the substrate, improving work efficiency and reducing costs by preventing material fallout and enhancing adhesion strength.
Implementation Method 1
an adhering composition including a resin component containing an epoxy resin, a curing agent, and an inorganic filler
Implementation Method 2
a resin component containing an epoxy resin, a curing agent
Data Source
Figure 1(a)~1(d)
Figure 2(a)~2(b)
AI summary
Provided are a heat dissipation material capable of ensuring stable adhesion while reducing cost, an inlay substrate using the same, and a method for manufacturing the same. A heat dissipation material having adhesive is obtained by coating a portion or the whole of the heat dissipation material with a heat dissipation material adhering composition including a resin component containing an epoxy resin, a curing agent, and an inorganic filler, and having a complex viscosity at 80°C of 1 × 103 Pa·s to 5 × 106 Pa·s.