Epoxy Resin Adhesive Shrinkage and Adhesion via Silica-Treated Polyolefin
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Solution Overview
Problem
Conventional epoxy resin adhesives for semiconductor applications face issues with shrinkage and adhesiveness due to thermal expansion, leading to cracks and deformation, and the addition of particles often results in uneven coatings and decreased adhesiveness due to poor compatibility and dispersibility.
Innovation Solution
Incorporating specific particulate polyolefin-based resins with a volume average particle size of 1 to 25 µm and surface-treated with silica, which improves dispersibility and adhesion, while maintaining low shrinkage properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If particles are added to epoxy adhesive to improve physical properties, then shrinkage resistance is improved, but adhesion performance and coating uniformity deteriorate due to poor compatibility and dispersibility
Solution Approach 1:
Silica particles serve as an intermediary material that mediates between the epoxy adhesive and the polyolefin-based resin particles. The silica particles are surface-treated to improve compatibility with both the epoxy matrix and the polyolefin particles, enabling homogeneous dispersion while maintaining adhesion performance. This intermediary approach resolves the contradiction by providing a bridging material that facilitates interaction between incompatible components.
Solution Approach 2:
The invention changes the particle size parameter of the polyolefin-based resin to a specific range (1-25 μm volume average particle size) and controls the particle morphology. By optimizing these parameters, the polyolefin particles achieve better dispersion in the epoxy adhesive without agglomeration, thereby improving both shrinkage resistance and adhesion performance simultaneously.
2Stability of the object's composition
If a large amount of particles is added to achieve low shrinkage, then shrinkage resistance is improved, but coating uniformity and adhesion decrease due to poor dispersibility
Solution Approach 1:
The invention optimizes the particle size parameter of the polyolefin-based resin to a specific range (1-25 μm volume average particle size). This parameter change enables the particles to disperse homogeneously in the epoxy adhesive even at high concentrations, achieving both low shrinkage and uniform coating without the need for excessive particle addition.
Solution Approach 2:
The invention applies local quality improvement by surface-treating the silica particles with specific treatments that enhance their interaction with the epoxy matrix. This localized modification of particle surfaces improves overall dispersion uniformity throughout the adhesive system, enabling high particle loading without compromising coating quality.
3Stability of the object's composition
If conventional particles are added to epoxy adhesive, then shrinkage properties are improved, but adhesion performance deteriorates due to incompatibility with epoxy resin
Solution Approach 1:
Silica particles act as an intermediary material that bridges the epoxy adhesive and polyolefin-based resin particles. The silica particles are surface-treated to improve compatibility with both the epoxy matrix and the polyolefin particles, enabling homogeneous dispersion while maintaining adhesion performance. This intermediary approach resolves the contradiction by providing a bridging material that facilitates interaction between incompatible components.
Solution Approach 2:
The invention creates a composite material system consisting of epoxy resin, curing agent, silica particles, and polyolefin-based resin particles. This composite structure combines the advantages of different materials: the epoxy matrix provides adhesion, the silica particles improve dispersion and compatibility, and the polyolefin particles provide shrinkage resistance. The synergistic combination resolves the adhesion-shrinkage contradiction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides an epoxy resin adhesive with suppressed shrinkage and excellent adhesiveness, preventing cracks and deformation, and enhancing the bonding strength and uniformity of the coating.
Implementation Method 1
a low-shrinkable epoxy resin composition has been disclosed which is obtained by melting and mixing an epoxy resin serving as a sealing resin with a polyolefin-based resin or an elastomer resin as a stress relaxing agent (shrinkage inhibitor)
Implementation Method 2
surface-treated with silica, which improves dispersibility and adhesion
Data Source
Figure 1~2
AI summary
The present invention provides an epoxy resin adhesive that exhibits low shrinkage and excellent adhesiveness. The epoxy resin adhesive includes (A) an epoxy resin, (B) a curing agent, and (C) a particulate polyolefin-based resin having a volume average particle size of 1 to 25 µm, wherein the particulate polyolefin-based resin is spherical, and wherein the particulate polyolefin-based resin is present in an amount of 1 to 50 parts by mass per 100 parts by mass of the epoxy resin.