Epoxy-Coated Circuit Assembly for Moisture-Resistant Soldering

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Solution Overview

Problem

Existing technologies face issues with moisture penetration leading to short circuits in electrodes and electronic components, particularly in high-temperature and humid environments, and the need to remove flux residue from solder paste.

Innovation Solution

A circuit device is developed with a coating layer made of an epoxy component that surrounds the side surfaces of electronic components, preventing moisture ingress and serving as a waterproof film, using a flux-free solder paste.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If solder paste containing flux is used for mounting electronic components, then the components can be properly soldered to the board, but flux residue remains and requires additional removal processes

Engineering Contradiction:

Improvesoldering qualityVSAvoidmanufacturing process complexity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The invention extracts and removes the flux component from the solder paste formulation, creating a flux-free solder paste that eliminates flux residue while maintaining soldering functionality through alternative mechanisms

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The invention converts the harmful flux residue problem into a benefit by using the solder paste composition and reflow process to create a protective coating layer that prevents moisture penetration, turning a manufacturing defect into a protective feature

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

2Ease of manufacture

If electronic components are mounted on the board without additional protective measures, then the manufacturing process is simple, but moisture penetrates into electrodes and components in high-temperature and humid environments causing short circuits

Engineering Contradiction:

Improvemanufacturing process simplicityVSAvoidresistance to moisture penetration

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The solder paste serves multiple functions: it provides soldering capability, forms a protective coating layer, and prevents moisture penetration, eliminating the need for separate protective coating processes

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The protective coating layer is formed preliminarily during the reflow soldering process itself, before the product is exposed to humid environments, providing proactive protection rather than requiring additional post-processing steps

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The epoxy coating layer effectively prevents moisture penetration, thereby reducing the risk of short circuits and eliminating flux residue, even in harsh environmental conditions.

Implementation Method 1

The coating layer may be formed by a mixture containing an epoxy component

Methodology Applied

Scientific EffectAdsorption: Adsorption

Implementation Method 2

a coating layer partially surrounding a side surface of the electronic component and having an upper surface spaced apart from the IC chip

Methodology Applied

Scientific EffectPhysical containment: Physical Containment

Data Source

PatentUS20260018540A1Circuit device and display device including the same

Publication Date: 2026.01.15 LG ELECTRONICS INC

AI summary

Disclosed are a circuit device and a display device including the same. The circuit device may include a board, an electronic component mounted on the board, an IC chip meeting an upper surface of the electronic component, and a coating layer partially surrounding a side surface of the electronic component and having an upper surface spaced apart from the IC chip.