Epoxy Dual Cure Resin for Additive Manufacturing

Solution Overview

Problem

Conventional additive manufacturing techniques are limited by the availability of materials with diverse properties, restricting the potential of three-dimensional fabrication, particularly in terms of material properties such as tensile strength, scratch resistance, and chemical resistance.

Innovation Solution

The development of epoxy dual cure resins comprising a photoinitiator, monomers/prepolymers, epoxy resin, optional hardeners, and fillers, which are solidified by light exposure and further cured through heating or microwave irradiation, enabling the creation of three-dimensional objects with enhanced mechanical and chemical properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If conventional photo curable resins are used for additive manufacturing, then layer formation can be achieved through UV or visible light irradiation, but the material properties such as tensile strength, scratch resistance, and chemical resistance are limited

Engineering Contradiction:
Core Design Contradiction:
StrengthVSAdaptability or versatility

Solution Approach 1:

The patent employs composite resin formulations combining epoxy resins with acrylate monomers and oligomers. The epoxy component provides superior mechanical strength, tensile properties, and chemical resistance, while the acrylate components enable photopolymerization. This composite approach allows the material to achieve enhanced mechanical properties unattainable with conventional single-component photo curable resins.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent modifies the chemical composition parameters of the resin system by incorporating specific ratios of epoxy resins, acrylate monomers, and oligomers. By adjusting these compositional parameters and using dual-cure mechanisms (photocuring followed by thermal or microwave curing), the material achieves transformed mechanical and chemical resistance properties suitable for demanding applications.

Inventive Principle:
Principle #35Parameter changes

2Strength

If conventional photo curable resins are used, then additive manufacturing can be performed with standard UV or visible light irradiation, but the scratch resistance and chemical resistance of the fabricated objects are insufficient

Engineering Contradiction:
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The resin composition integrates epoxy resins known for their excellent chemical resistance and scratch hardness with photopolymerizable acrylate groups. This composite structure provides both the mechanical durability (scratch resistance) and chemical inertness required for reliable performance in harsh environments, while maintaining compatibility with additive manufacturing processes.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent alters the chemical composition to include epoxy resins with specific molecular structures and crosslink densities that enhance scratch resistance and chemical resistance. The dual-cure mechanism (photocuring plus thermal/microwave curing) further transforms the material parameters to achieve the desired reliability and durability properties.

Inventive Principle:
Principle #35Parameter changes

3Strength

If a dual cure resin system is used comprising both photopolymerizable and epoxy components, then enhanced mechanical properties can be achieved, but the process complexity increases with multiple curing steps

Engineering Contradiction:
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The photopolymerizable acrylate components undergo preliminary curing during the additive manufacturing process, forming a green part with sufficient structural integrity for handling. This preliminary action allows the object to be fabricated layer-by-layer, after which thermal or microwave curing completes the crosslinking to achieve final mechanical properties, thereby dividing the curing process into manageable stages.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The resin system is designed to perform multiple functions: it enables photopolymerization for additive manufacturing, provides structural integrity during fabrication, and undergoes subsequent thermal/microwave curing to achieve final mechanical properties. This multi-functionality reduces the need for separate materials for different process stages, simplifying the overall system despite the multi-step curing process.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The described method and resin compositions enable the production of three-dimensional objects with high tensile strength, scratch resistance, and chemical resistance, suitable for various applications including electronic devices and mechanical components.

Implementation Method 1

monomers and/or prepolymers that are polymerizable by exposure to actinic radiation or light

Methodology Applied
Scientific EffectPhotopolymerisation: Photopolymerisation

Implementation Method 2

heating and/or microwave irradiating said three-dimensional intermediate sufficiently to further cure said resin

Methodology Applied
Scientific EffectMicrowave irradiation: Microwave Radiation

Data Source

PatentUS11814472B2Epoxy dual cure resins for additive manufacturing
Publication Date: 2023.11.14
  • US11814472B2 patent drawing
  • US11814472B2 patent drawing
  • US11814472B2 patent drawing

AI summary

An epoxy dual cure resin useful for additive manufacturing of three-dimensional objects includes: (i) a photoinitiator; (ii) monomers and/or prepolymers that are polymerizable by exposure to actinic radiation or light; (iii) optionally, a light absorbing pigment or dye; (iv) an epoxy resin; (v) optionally, but in some embodiments preferably, an organic hardener co-polymerizable with the epoxy resin; (vi) optionally but preferably a dual reactive compound having substituted thereon a first reactive group reactive with said monomers and/or prepolymers that are polymerizable by exposure to actinic radiation or light, and a second reactive group reactive with said epoxy resin (e.g., an epoxy acrylate); (vii) optionally a diluent; (viii) optionally a filler; and (ix) optionally, a co-monomer and/or a co-prepolymer. Methods of using the same in additive manufacturing are also described.