Epoxy Emulsion Sealing for Shallow Wellbore Apertures
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Solution Overview
Problem
Conventional cementing slurries set quickly, limiting their use to shallow wellbore depths and leading to incomplete filling and stabilization of apertures, while polymers either cure too slowly or are washed away by pressurized fluids, necessitating a need for compositions that can effectively fill, seal, or stabilize apertures at shallower depths.
Innovation Solution
Epoxy resin compositions with a block copolymer surfactant that de-emulsify at specific temperature ranges, allowing for selective curing and stabilization of apertures at shallow wellbore depths, providing high mechanical strength and bonding to adjacent cement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional cementing slurries are used, then they set quickly providing initial stabilization, but they cannot be made long in advance and cannot fully fill apertures due to high viscosity
Solution Approach 1:
The patent changes the physical state of the composition from a high-viscosity slurry to a low-viscosity emulsion that can be stored and transported easily, then transforms it back to a solidified state at the target location through temperature-induced de-emulsification and curing
Solution Approach 2:
The composition undergoes phase transitions: starting as a stable emulsion (liquid phase) at ambient temperature, then de-emulsifying into separate phases when exposed to elevated downhole temperatures, followed by curing to form a solidified matrix that stabilizes the aperture
2Loss of time
If polymers are used to fill apertures, then they can be prepared in advance, but they either cure too rapidly or require temperatures greater than 100°C to cure
Solution Approach 1:
The patent modifies the curing behavior by formulating an epoxy resin system with a curing agent that remains stable at ambient temperatures but activates at moderate downhole temperatures (35-100°C), achieving optimal curing kinetics without requiring excessive heat
Solution Approach 2:
The composition combines epoxy resin with a curing agent and surfactant to create a composite material that exhibits temperature-responsive behavior: stable as an emulsion at low temperatures, then undergoes de-emulsification and curing at moderate temperatures to achieve rapid solidification in the target zone
3Loss of time
If polymer curing kinetics are slowed to prevent rapid curing, then the polymer can be transported, but the partially cured polymer is washed away by pressurized fluids
Solution Approach 1:
The patent optimizes the curing kinetics by selecting epoxy resin and curing agent combinations that maintain stability during transport but initiate rapid curing when exposed to downhole conditions, ensuring the material solidifies quickly enough to resist washout while remaining transportable
Solution Approach 2:
The emulsion formulation acts as an intermediary state that protects the reactive components during transport, then facilitates controlled release and curing at the target location through temperature-induced de-emulsification, preventing premature reaction while ensuring reliable solidification
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The epoxy resin compositions achieve efficient filling and sealing of apertures with high mechanical strength and bonding, reducing wellbore plugging and fluid loss, while being shelf-stable at ambient temperatures and curing at elevated temperatures.
Implementation Method 1
The method includes de-emulsifying the emulsion in the wellbore to form a water phase and an epoxy phase
Implementation Method 2
epoxy resin compositions with a block copolymer surfactant that de-emulsify at specific temperature ranges, allowing for selective curing and stabilization of apertures at shallow wellbore depths
Implementation Method 3
curing the epoxy phase in the aperture after de-emulsifying the emulsion
Implementation Method 4
The composition includes an epoxy resin, a curing agent, water, and a block copolymer surfactant
Implementation Method 5
The block copolymer surfactant has at least one hydrophilic block and at least one hydrophobic block
Implementation Method 6
providing an emulsion to a wellbore. The emulsion comprises an epoxy resin, a curing agent, water, and a block copolymer surfactant
Data Source
AI summary
Embodiments of the present disclosure generally relate to epoxy resin compositions and uses thereof. In some embodiments, a method includes providing an emulsion to a wellbore. The emulsion comprises an epoxy resin, a curing agent, water, and a block copolymer surfactant. The method includes de-emulsifying the emulsion in the wellbore to form a water phase and an epoxy phase and applying the epoxy phase to a wellbore component. The method includes curing the epoxy phase in the aperture after de-emulsifying the emulsion.