Epoxy Encapsulation Composition for Stable High-Temperature Gap Filling
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Solution Overview
Problem
Existing encapsulation materials for organic light-emitting display devices face issues with adhesiveness and high-temperature stability, leading to operability and reliability concerns, especially when used in gap filling methods involving low-viscosity liquids.
Innovation Solution
An epoxy resin composition comprising a highly adhesive bifunctional epoxy resin, diluted epoxy resin, latent thermal curing agent, and curing retarder, which provides high adhesiveness and stability during curing, suitable for binding and molding glass parts of display screens.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a heavy chamber made of glass or transparent inorganic material is used to confine and seal the organic light emitting display device, then high-temperature stability and protection are improved, but weight and product thinning are worsened
Solution Approach 1:
The patent changes the physical and chemical parameters of the encapsulation material by using a two-component epoxy resin system with specific molecular weight ratios and curing agents. This allows the material to achieve high-temperature stability (maintaining viscosity control up to 80°C) without requiring heavy inorganic glass chambers, thus resolving the contradiction between reliability and weight.
Solution Approach 2:
The patent employs a composite encapsulation material consisting of epoxy resin, diluent, curing agent, and filler in specific proportions. This composite formulation achieves both the mechanical strength and thermal stability of inorganic materials while maintaining the low weight and flexibility of organic polymers, eliminating the need for heavy glass chambers.
2Ease of operation
If conventional epoxy resin is used for gap filling, then ease of operation is maintained, but high-temperature stability and adhesiveness are worsened
Solution Approach 1:
The patent modifies the chemical parameters of epoxy resin by selecting specific bisphenol A diglycidyl ether and bisphenol F diglycidyl ether with controlled molecular weights and epoxy equivalent weights. It also optimizes the curing agent ratio and adds fillers, enabling the material to maintain low viscosity for easy dispensing while achieving high-temperature stability through controlled cross-linking density.
3Adaptability or versatility
If low-viscosity liquid is injected for gap filling, then ease of operation and adaptability are improved, but high-temperature stability during curing is worsened
Solution Approach 1:
The patent changes the viscosity parameter of the epoxy resin by controlling molecular weight and adding appropriate diluents, enabling low-viscosity liquid injection for gap filling. Simultaneously, it optimizes the curing system (curing agent type and ratio) to ensure that cross-linking reaction proceeds controllably at elevated temperatures, maintaining stability during the curing process despite the initial low viscosity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The epoxy resin composition offers excellent processability, electrical, mechanical, and chemical properties, ensuring good workability, productivity, and reliability under high-temperature conditions.
Implementation Method 1
a latent thermal curing agent
Implementation Method 2
a curing retarder
Data Source
AI summary
Proposed are an epoxy resin composition having high- temperature stability and an encapsulant including the same. The composition can be applied to various gap filling methods in which a low-viscosity liquid is injected into a gap through ink jetting or dispensing and then the liquid is cured. The composition has high adhesiveness and high-temperature stability during curing. Therefore, the composition can be used to bind or mold glass parts of organic and inorganic light-emitting display screens.