Mesogenic Siloxane Epoxy Resin for Heat Conduction and Adhesion
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Solution Overview
Problem
Electronic component devices face challenges with heat dissipation due to low heat conductivity of cured thermosetting resin products and are prone to warping, leading to detachment issues due to thermal stress.
Innovation Solution
Development of an epoxy resin with a mesogenic and siloxane structure, which combines high heat conductivity with low elasticity, achieved through specific molecular formulations and curing processes, forming high-order structures that enhance thermal management and adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a cured product of a thermosetting resin is used for heat dissipation, then heat conductivity is required to be improved, but the inherent low heat conductivity of conventional thermosetting resin cured products prevents effective heat dissipation
Solution Approach 1:
The patent changes the molecular structure parameters of the epoxy resin by introducing mesogenic groups (rigid aromatic structures) and siloxane bonds into the molecular chain. This structural modification enables the cured product to achieve high heat conductivity while maintaining the thermosetting resin's beneficial properties, directly resolving the heat dissipation problem
Solution Approach 2:
The patent creates a composite molecular structure combining epoxy resin with mesogenic groups and siloxane bonds. This composite approach integrates the heat-resistant and adhesive properties of epoxy resin with the high heat conductivity and flexibility of mesogenic and siloxane structures, achieving both thermal management and mechanical stability
2Volume of moving object
If the electronic component device is made thinner, then miniaturization is achieved, but the difference in thermal expansion coefficient between chip and substrate causes warping and detachment
Solution Approach 1:
The patent modifies the elasticity parameter of the cured product by incorporating siloxane bonds, which provide flexible Si-O-Si linkages in the molecular chain. This increases the elasticity and flexibility of the cured product, enabling it to withstand thermal expansion differences and prevent warping and detachment in thin devices
Solution Approach 2:
The patent creates a flexible cured product structure through siloxane incorporation that can accommodate dimensional changes and stress in thin electronic devices. The flexible molecular structure acts as a buffer against thermal stress, preventing warping and maintaining adhesion in miniaturized devices
3Stability of the object's composition
If the elasticity of the cured product is decreased to suppress detachment, then adhesion stability is improved, but the heat conductivity must be maintained at high levels
Solution Approach 1:
The patent merges multiple functional groups into a single epoxy resin molecule: mesogenic groups for heat conductivity, siloxane bonds for elasticity and flexibility, and epoxy groups for crosslinking and adhesion. This combination achieves both high heat conductivity and low elasticity simultaneously, resolving the contradiction between thermal management and adhesion stability
Solution Approach 2:
The patent designs an epoxy resin with multi-functionality: the mesogenic structure provides heat conduction pathways, the siloxane bonds provide flexibility and stress relief, and the epoxy groups provide crosslinking and adhesion. This multi-functional molecule addresses multiple requirements (heat dissipation, flexibility, adhesion) simultaneously
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The epoxy resin composition effectively improves heat conductivity and reduces the likelihood of detachment from electronic components, addressing both thermal management and mechanical stability concerns.
Implementation Method 1
the epoxy resin composition, a resin sheet, a B-stage sheet, a C-stage sheet, a cured product... having a mesogenic structure... capable of forming a high order structure
Implementation Method 2
an object of the present invention is to provide an epoxy resin which cured product is superior in heat conductivity, and capable of achieving a low elasticity
Data Source
AI summary
An epoxy resin has a mesogenic structure and a siloxane structure. An epoxy resin composition includes the epoxy resin having the mesogenic structure and the siloxane structure, and a curing agent.