Semiconductor Package Molding Structure for Upward Heat Dissipation
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Solution Overview
Problem
The semiconductor industry faces challenges in dissipating heat efficiently from miniaturized, high-density semiconductor packages, particularly in Package-on-Package and side-by-side structures, leading to thermal stress and reliability issues due to the low thermal conductivity of traditional epoxy molding compounds.
Innovation Solution
Incorporating a first epoxy molding compound with higher thermal conductivity than the second epoxy molding compound in heat dissipation structures within the semiconductor package, creating a heat dissipation path that directs heat upwards, thereby improving thermal characteristics and reducing warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional epoxy molding compound is used to mold semiconductor structures, then manufacturing cost and ease of manufacture are maintained, but thermal conductivity is insufficient leading to poor heat dissipation
Solution Approach 1:
The patent uses a composite molding material comprising epoxy molding compound mixed with thermally conductive particles (such as aluminum oxide, aluminum nitride, or boron nitride). This composite structure combines the ease of manufacturing and bonding properties of epoxy with the high thermal conductivity of ceramic particles, enabling effective heat dissipation while maintaining manufacturing feasibility and product reliability.
2Productivity
If semiconductor package is miniaturized and integrated density is increased, then integration density and device functionality are improved, but heat dissipation becomes more difficult due to increased power consumption per unit volume
Solution Approach 1:
The patent changes the thermal conductivity parameter of the molding material by incorporating thermally conductive particles with specific properties (particle size, shape, and material composition). This parameter modification enables the molding compound to effectively conduct heat away from miniaturized high-density semiconductor devices, allowing increased integration density without compromising thermal management.
3Temperature
If heat dissipation structure with high thermal conductivity material is used, then thermal characteristics are improved, but device complexity and manufacturing complexity increase
Solution Approach 1:
The patent merges the heat dissipation function with the existing molding compound by incorporating thermally conductive particles directly into the epoxy matrix. This integration eliminates the need for separate heat dissipation structures, maintaining simple device architecture while achieving improved thermal characteristics through the composite material's inherent conductivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces the temperature of semiconductor dies and enhances the operational reliability and performance of semiconductor packages by improving heat dissipation and minimizing thermal stress.
Implementation Method 1
at least one heat dissipation structure on the semiconductor structure, wherein the at least one heat dissipation structure comprises a first epoxy molding compound
Implementation Method 2
a molding material molding the semiconductor structure and the at least one heat dissipation structure, and disposed on the redistribution layer structure, wherein the molding material comprises a second epoxy molding compound
Data Source
AI summary
A semiconductor package includes a redistribution layer structure, a semiconductor structure on the redistribution layer structure, at least one heat dissipation structure on the semiconductor structure, where the at least one heat dissipation structure may include a first epoxy molding compound, a molding material for molding the semiconductor structure and the at least one heat dissipation structure, on the redistribution layer structure, where the molding material may include a second epoxy molding compound, where the first epoxy molding compound may have higher thermal conductivity than the second epoxy molding compound.