Epoxy Molding Resin Composition for Easier Continuous Mold Release
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Solution Overview
Problem
Existing epoxy resin compositions for electronic component devices lack sufficient release properties, hindering efficient continuous molding processes.
Innovation Solution
A resin composition comprising a sulfur atom-containing epoxy resin, a curing agent, an inorganic filler, and a copolymer of α-olefin with maleic anhydride, along with a polyethylene oxide release agent, which enhances the dispersion and exudation of the release agent, facilitating easier mold release.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional epoxy resin compositions are used with existing release agents, then the resin provides good electrical properties, moisture resistance, heat resistance, and mechanical strength, but the release properties from the mold are insufficient, hindering continuous molding efficiency
Solution Approach 1:
The patent combines polyethylene oxide (release agent) with copolymer of α-olefin and maleic anhydride derivative to create a composite release system. This composite material provides both excellent release properties and maintains the structural integrity needed for continuous molding, resolving the contradiction between productivity and ease of operation.
Solution Approach 2:
The patent specifies precise parameter ranges for the copolymer (5-30 carbon atoms in α-olefin, specific maleic anhydride derivative content) and polyethylene oxide (molecular weight, acid value) to optimize release properties. By controlling these parameters within specific ranges, the invention achieves both improved release characteristics and maintained molding efficiency.
2Productivity
If a release agent is added to achieve smooth release from the mold, then productivity improves, but the release agent must be properly dispersed and exuded without affecting the resin's electrical properties, moisture resistance, and mechanical strength
Solution Approach 1:
The copolymer of α-olefin and maleic anhydride derivative acts as an intermediary between the polyethylene oxide release agent and the epoxy resin matrix. It facilitates proper dispersion and controlled exudation of the release agent while maintaining the resin's electrical properties, moisture resistance, and mechanical strength, thus improving productivity without compromising reliability.
Solution Approach 2:
The invention creates local quality differences by having the release agent system (polyethylene oxide + copolymer) concentrate at the mold interface where release is needed, while the bulk resin maintains its electrical and mechanical properties. This localized action allows productivity improvement without affecting overall reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves improved release properties, allowing for easier removal of the cured product from the mold and promoting continuous molding efficiency.
Implementation Method 1
enhances the dispersion and exudation of the release agent, facilitating easier mold release
Data Source
AI summary
The resin composition for molding includes: a sulfur atom-containing epoxy resin; a curing agent; a release agent; an inorganic filler; and a copolymer of a C5-30 α-olefin and at least one of maleic anhydride and a maleic anhydride derivative.