Liquid Epoxy Molding Compound Warpage Reduction
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Solution Overview
Problem
Traditional liquid epoxy molding compounds exhibit high warpage heights, which can render packaged electronic products unusable and increase production costs due to defective products.
Innovation Solution
A liquid epoxy molding compound comprising 83%-88% inorganic silicon filler with a particle size of less than 50 μm-100 μm, 5%-10% naphthalene-based epoxy resin, 5%-10% anhydride curing agent, and 0.1%-0.5% accelerator, processed through premixing, grinding, and vacuum degassing to reduce warpage and coefficient of thermal expansion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional liquid epoxy molding compounds are used, then the packaging process is simple, but the warpage height is too high causing defective products
Solution Approach 1:
The patent changes the particle size parameter of the inorganic filler from conventional sizes to specifically 5-10 μm, and adjusts the mass fraction parameters of different components (epoxy resin 30-70%, curing agent 10-30%, accelerator 0.1-5%, inorganic filler 5-20%). These parameter changes optimize the material properties to reduce warpage height while maintaining packaging reliability.
Solution Approach 2:
The patent creates a composite material system combining epoxy resin, curing agent, accelerator, and inorganic filler (such as silica or glass beads) in specific proportions. This composite formulation works synergistically to reduce the coefficient of thermal expansion and minimize warpage during the molding process, thereby improving both manufacturing precision and packaging success rate.
2Reliability
If the warpage height is reduced to acceptable levels, then packaging success rate improves, but production costs increase due to stricter material specifications
Solution Approach 1:
The patent specifies a relatively broad particle size range (5-10 μm) and mass fraction ranges for each component, which allows for flexible material sourcing and processing while still achieving the desired warpage control. This parameter optimization balances manufacturing precision requirements with production cost considerations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the warpage height of the liquid epoxy molding compound to acceptable levels, improving packaging success rates and reducing production costs by minimizing defective products.
Implementation Method 1
the warpage height of the liquid epoxy molding compound is reduced to acceptable levels
Implementation Method 2
performing vacuum degassing to obtain the liquid epoxy molding compound
Data Source
AI summary
Disclosed is a liquid epoxy molding compound and a preparation method thereof; the liquid epoxy molding compound includes the following raw materials by mass fraction: an inorganic silicon filler: 83%-88%, a naphthalene-based epoxy resin: 5%-10%, an anhydride curing agent: 5%-10%, and an accelerator: 0.1%-0.5%, where the inorganic silicon filler with a particle size of less than 50 μm-100 μm accounts for 99%; the method includes premixing the naphthalene-based epoxy resin, the curing agent, the accelerator, and the inorganic silicon filler to obtain a mixture; and grinding the mixture to a target particle size, and then performing vacuum degassing to obtain the liquid epoxy molding compound. The small-particle silica is introduced to reduce the increase in length of the liquid epoxy molding compound at the unit temperature during the molding stage.