Electronic Package Protective Layer for Heat-Driven Solder Wetting
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Solution Overview
Problem
Conventional semiconductor packages face issues with heat accumulation due to low thermal conductivity of dielectric materials like polyimide, leading to solder material non-wetting and adhesion problems during the separation process.
Innovation Solution
Employing an epoxy molding compound with high thermal conductivity as a protective layer to facilitate heat transfer and solidify during the cooling process, preventing solder material non-wetting and adhesion to removal tools.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a dielectric layer made of polyimide material is formed on the electronic body to cover the conductors, then the conductors are protected, but the thermal conductivity is low causing heat accumulation and solder material non-wetting
Solution Approach 1:
The patent changes the material parameter of the protective layer from polyimide (low thermal conductivity) to epoxy molding compound (high thermal conductivity). This parameter change maintains the protective function while significantly improving heat dissipation, preventing heat accumulation and solder material non-wetting issues.
Solution Approach 2:
The patent uses epoxy molding compound as a composite material that combines both protective and high thermal conductivity properties. This composite material simultaneously provides mechanical protection to conductors and efficient heat transfer pathways, resolving the contradiction between protection and thermal management.
2Reliability
If a dielectric layer made of polyimide material is used during the cooling process, then the electronic body is protected, but the material remains semi-soluble fluid state causing adhesion to removal tools
Solution Approach 1:
The patent changes the material state parameter during cooling by using epoxy molding compound that transitions from liquid to solid state. This parameter change eliminates the semi-soluble fluid state problem, preventing adhesion to removal tools while maintaining protective function throughout the process.
Solution Approach 2:
The patent utilizes the phase transition property of epoxy molding compound from liquid to solid during cooling. This phase transition ensures the material remains stable and non-adhesive during separation, resolving the contradiction between protection and ease of operation.
3Temperature
If epoxy molding compound is used as protective layer, then thermal conductivity is improved for effective heat transfer, but additional manufacturing steps are required
Solution Approach 1:
The patent applies epoxy molding compound that serves multiple functions: it provides mechanical protection to conductors, enables efficient heat transfer, and facilitates easy separation during cooling. This multi-functionality compensates for the additional manufacturing steps by consolidating multiple requirements into a single material solution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effective heat transfer to melt solder materials and prevent adhesion of removal tools, ensuring smooth separation and improved manufacturing efficiency.
Implementation Method 1
the thermal conductivity of the epoxy molding compound is relatively high (that is, greater than 1 W/mK), so that the heat energy can be effectively transmitted to the solder material below
Implementation Method 2
in the cooling process, the epoxy molding compound is set in shape after thermosetting (i.e., becoming a solid)
Data Source
AI summary
An electronic structure is provided, in which a plurality of conductors are disposed on one surface of an electronic body, an epoxy molding compound is used as a protective layer to encapsulate the plurality of conductors, a circuit portion is bonded onto the other surface of the electronic body, and a plurality of external bumps and solder material are formed on the circuit portion. Therefore, with the design of the protective layer, heat energy can be effectively transferred from the protective layer to the solder material below during a process of heating the electronic structure so as to avoid a problem of non-wetting of the solder material.