Epoxy-Polyarylate Resin Composition for Heat and Plating Adhesion
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Solution Overview
Problem
Existing thermosetting epoxy resin compositions with a naphthalene structure fail to achieve a glass transition temperature of 180 °C or higher, compromising heat resistance, while increasing crosslink density for this purpose reduces plating adhesion.
Innovation Solution
A curable resin composition comprising specific ratios of epoxy resin, polyarylate compound with a bisphenol structure and ester group, and inorganic filler, with a photopolymerization initiator and photopolymerizable compound being absent, to form a cured product with high glass transition temperature, low dielectric tangent, and excellent plating adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the crosslink density of the cured product is increased to improve heat resistance, then the glass transition temperature increases, but plating adhesion deteriorates
Solution Approach 1:
The invention changes the chemical composition parameters by introducing a polyarylate compound with specific functional groups (ester groups and phenolic hydroxyl groups) and controlling the equivalent amount ratio between epoxy groups and these functional groups. This parameter optimization enables achieving high glass transition temperature (180°C or higher) while maintaining excellent plating adhesion through balanced crosslink density and surface properties
Solution Approach 2:
The invention creates a composite resin composition combining epoxy resin with a polyarylate compound having bisphenol structure and ester groups. This composite material achieves synergistic effects where the polyarylate compound contributes to low dielectric tangent and enhanced adhesion, while the epoxy resin provides crosslinking capability, resulting in a cured product with both high heat resistance and excellent plating adhesion
2Temperature
If the blending ratio of active ester compound is increased to increase crosslink density, then glass transition temperature improves, but plating adhesion deteriorates
Solution Approach 1:
The invention optimizes the equivalent amount ratio parameter between epoxy groups and ester groups/phenolic hydroxyl groups to fall within 0.10 to 1.20. This precise parameter control prevents excessive crosslink density that would harm adhesion, while still achieving sufficient crosslinking for high glass transition temperature (180°C or higher)
3Reliability
If a naphthalene structure active ester compound is used to achieve low dielectric tangent, then dielectric properties improve, but glass transition temperature remains below 180°C
Solution Approach 1:
The invention combines epoxy resin with a polyarylate compound having bisphenol structure and ester groups to create a composite system. This composite material achieves both low dielectric tangent (0.008 or lower) and high glass transition temperature (180°C or higher) through the synergistic contribution of polyarylate compound's low dielectric properties and controlled crosslinking capability
Solution Approach 2:
The invention changes the molecular structure parameters by selecting polyarylate compounds with specific functional groups (ester groups and phenolic hydroxyl groups) and controlling their equivalent amount ratio. This parameter optimization enables achieving both low dielectric tangent and high glass transition temperature simultaneously
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves a dielectric tangent of less than 0.008, peel strength from plating of 3.5 N/cm or more, and a glass transition temperature of 180 °C or more, maintaining excellent heat resistance and adhesion.
Implementation Method 1
a curable resin composition comprising (A) an epoxy resin; (B) a polyarylate compound having a bisphenol structure and an ester group
Implementation Method 2
the content of the (C) inorganic filler is 38 to 82 % by mass on a solid amount basis
Data Source
AI summary
The present invention provides a curable resin composition capable of forming a cured product having a low dielectric tangent, excellent plating adhesion, and excellent heat resistance. The curable resin composition of the present invention is a curable resin composition comprising (A) an epoxy resin, (B) a polyarylate compound having a bisphenol structure and an ester group, and (C) an inorganic filler, wherein a ratio of an equivalent amount derived from the content of epoxy groups comprised in the (A) epoxy resin to an equivalent amount derived from the content of ester groups and phenolic hydroxyl groups comprised in the (B) polyarylate compound having a bisphenol structure and an ester group is 0.10 to 1.20, and the content of the (C) inorganic filler is 38 to 82 % by mass on a solid amount basis.