Epoxy-Containing Polymer Protective Film for Electronic Parts
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing protective films for semiconductor devices and dielectric films for multilayer printed wiring boards lack sufficient chemical resistance, especially in solder flux fluids, and reliability under thermal cycling tests.
Innovation Solution
A photo-curable resin composition comprising an epoxy-containing polymer with a specific molecular structure, combined with a crosslinking agent, photoacid generator, and solvent, which forms a thick film that can be patterned and post-cured at low temperature, providing improved chemical resistance and mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If photosensitive silicone composition is used to achieve flexibility and low temperature curing, then moisture-resistant adhesion is improved, but chemical resistance in solder flux fluid deteriorates
Solution Approach 1:
The patent uses a composite material system combining siloxane backbone structure with aromatic hydrocarbon side chains. The siloxane provides flexibility and adhesion, while the aromatic side chains contribute to chemical resistance. This composite structure resolves the contradiction by integrating materials with complementary properties into a single polymer system that achieves both moisture-resistant adhesion and chemical resistance in solder flux fluid.
2Area of stationary object
If thick film is formed to provide adequate protection, then protective coverage is improved, but pattern definition precision deteriorates
Solution Approach 1:
The patent changes the chemical and physical parameters of the polymer to enable thick film formation with maintained pattern precision. The specific molecular structure with controlled side chain length and hydroxyl group positioning alters the polymer's glass transition temperature, curing characteristics, and etch resistance. These parameter changes allow the formation of thick films (several micrometers) that still define fine patterns accurately after photo-curing and etching processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the formation of a protective film with enhanced adhesion, mechanical strength, and chemical resistance, preventing cracking under thermal cycling tests and ensuring reliability for semiconductor devices and electronic components.
Implementation Method 1
a photoacid generator which is decomposed to generate an acid upon exposure to radiation having a wavelength of 190 to 500 nm
Implementation Method 2
at least one crosslinking agent selected from the group consisting of an amino condensate modified with formalin or formalin-alcohol and a phenol compound having on the average at least two methylol or alkoxymethylol radicals in the molecule
Data Source
AI summary
A photo-curable resin composition comprising an epoxy-containing silphenylene or silicone polymer with a Mw of 3,000-500,000 forms a coating which is useful as a protective film for electric/electronic parts.