Epoxy Polysiloxane Curable Composition for Low-Dielectric Lithography
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Solution Overview
Problem
Conventional polysiloxane materials used in photolithography for semiconductor manufacturing are inadequate in low dielectric properties, which leads to increased transmission loss in fine circuits.
Innovation Solution
A curable composition comprising a polysiloxane with specific structural units and a photoradical generator, incorporating epoxy groups and unsaturated carbon bonds, is developed to enhance low dielectric properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional polysiloxane materials are used in photolithography, then the material provides good insulation performance and chemical stability, but the low dielectric properties are insufficient leading to increased transmission loss in fine circuits
Solution Approach 1:
The patent uses a composite resin composition comprising polysiloxane and silane components with specific functional groups (epoxy, acryloyl, methacryloyl) to achieve both good insulation performance and low dielectric properties. The combination of multiple functional groups in the polymer structure allows simultaneous optimization of electrical properties and mechanical properties, resolving the contradiction between reliability and energy loss.
2Loss of energy
If polysiloxane with specific structure is used to improve low dielectric properties, then transmission loss is reduced, but the composition complexity increases
Solution Approach 1:
The patent optimizes the molecular weight and functional group content of the polysiloxane to achieve the desired dielectric properties. By controlling the average molecular weight within specific ranges and adjusting the content of epoxy groups, acryloyl groups, and methacryloyl groups, the composition achieves low dielectric properties without excessive structural complexity.
3Reliability
If the polysiloxane contains specific functional groups (epoxy, acryloyl, methacryloyl) to enhance low dielectric properties, then the cured product achieves excellent low dielectric properties, but the manufacturing precision requirements increase
Solution Approach 1:
The patent introduces specific functional groups (epoxy, acryloyl, methacryloyl) at specific positions within the polysiloxane molecule to achieve localized chemical reactivity and desired electrical properties. The epoxy groups provide crosslinking capability while acryloyl and methacryloyl groups contribute to low dielectric properties, with each functional group positioned to serve its specific purpose in the overall polymer structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition forms a cured product with excellent low dielectric properties, enabling effective pattern formation in photolithography and reducing transmission loss in semiconductor devices.
Implementation Method 1
a curable composition containing a polysiloxane having an epoxy group and a compound represented by the following formula (1)... The curable composition preferably further contains a photoradical generator
Data Source
AI summary
Provided is a curable composition excellent in low dielectric properties. An embodiment of the present invention is a curable composition containing a polysiloxane having an epoxy group and a compound represented by the following formula (1). In the formula, G represents an organic group, and X represents a group represented by the following general formula (1)-11, (1)-12, (1)-13, or (1)-14.