Epoxy Resin Composition Composite Curing Agent PCB
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Solution Overview
Problem
Epoxy resin compositions used in printed circuit boards face challenges with brittleness, high water absorption, and unsatisfactory electrical performance, particularly when using amino-triazine-novolac resin as a single curing agent, which affects processability and dielectric properties.
Innovation Solution
A composite curing agent comprising 10 to 15 parts by weight of amino-triazine-novolac resin, 4 to 8 parts by weight of diaminodiphenylsulfone, and 0.1 to 5 parts by weight of dicyandiamide, along with an epoxy resin having at least two epoxy groups, is used to form an interpenetrating polymeric network, enhancing heat resistance, chemical resistance, and peeling strength, while optionally including a curing accelerator and inorganic filler.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If amino-triazine-novolac resin is used as a single curing agent for epoxy resin, then heat resistance and chemical resistance are improved, but processability and dielectric properties deteriorate
Solution Approach 1:
The patent combines amino-triazine-novolac resin with diaminodiphenylsulfone and dicyandiamide to form a composite curing agent system. This merging of multiple curing agents allows the benefits of amino-triazine-novolac (heat and chemical resistance) to be achieved while mitigating its drawbacks through the contributing properties of the other curing agents, thereby improving overall processability and dielectric properties.
Solution Approach 2:
The patent employs a composite curing agent comprising multiple components (amino-triazine-novolac resin, diaminodiphenylsulfone, and dicyandiamide) to create a synergistic effect. This composite approach allows the system to achieve superior heat resistance, chemical resistance, and dielectric properties simultaneously, while maintaining good processability characteristics that single curing agents cannot provide alone.
2Reliability
If epoxy resin is cross-linked with multi-functional amine to form IPN, then chemical resistance and glass transition temperature are improved, but brittleness increases making processing difficult
Solution Approach 1:
The patent modifies the curing system by changing the parameters of the curing agents used. Instead of using a single multi-functional amine that creates highly cross-linked brittle IPN, the patent employs a composite curing agent system with different functional characteristics. This parameter change in the curing agent composition allows for a more balanced cross-linking structure that maintains chemical resistance and glass transition temperature while reducing excessive brittleness and improving processability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved processability, high glass transition temperature, excellent dielectric properties, and low water absorption, resulting in copper-clad laminates with superior peeling strength and chemical resistance, meeting the requirements for printed circuit boards.
Implementation Method 1
The epoxy resins can be cross-linked with a multi-functional amine to form an interpenetrating polymeric network (IPN)
Implementation Method 2
Although IPNs have favorable properties such as high glass transition temperature and high chemical resistance
Data Source
AI summary
Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin; (B) a composite curing agent, including amino-triazine-novolac resin, diaminodiphenylsulfone, and dicyandiamide mixed in a certain proportion; (C) a curing accelerator; and (D) an optional inorganic filler.