Epoxy Resin Composition for Composite Molding

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Solution Overview

Problem

Current methods for high-cycle compression molding of carbon-fiber reinforced composite materials require high temperatures and long thermosetting times, leading to resin viscosity issues and defective products due to excessive resin outflow, while high-viscosity epoxy resins improve heat tolerance but hinder handling and curing speed.

Innovation Solution

A prepreg composed of an epoxy resin composition containing specific components such as imidazole compounds and sulfur-containing epoxy resins, which maintains high glass transition temperature and suppresses resin outflow, allowing for efficient high-cycle compression molding at lower temperatures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If high temperature and long thermosetting time are used, then mechanical strength and heat tolerance are improved, but resin viscosity decreases excessively causing resin outflow and molding defects

Engineering Contradiction:
Improvemechanical strengthVSAvoidmolding quality
Core Design Contradiction:
StrengthVSManufacturing precision

Solution Approach 1:

The patent modifies the chemical composition parameters of the epoxy resin system by introducing a specific amine compound with particular molecular structure characteristics. This changes the curing reaction kinetics and the temperature-viscosity relationship of the resin, allowing the material to maintain higher viscosity at elevated temperatures during compression molding, thereby preventing resin outflow while still achieving complete curing and high mechanical strength

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite epoxy resin system by combining multiple epoxy resin components with a specifically selected amine compound. This composite resin formulation achieves synergistic effects where the amine compound modifies the curing behavior to maintain viscosity stability across a wide temperature range, preventing the harmful resin outflow that occurs with conventional single-component epoxy systems under high-temperature compression molding

Inventive Principle:
Principle #40Composite materials

2Manufacturing precision

If high-viscosity epoxy resin is used, then resin outflow is suppressed, but handling ease and curing speed decrease

Engineering Contradiction:
Improveresin outflow controlVSAvoidhandling ease
Core Design Contradiction:
Manufacturing precisionVSEase of operation

Solution Approach 1:

The patent introduces a amine compound that creates a dynamic viscosity response to temperature changes. The resin viscosity remains high at room temperature for easy handling and suppression of outflow, but the curing reaction kinetics are modified to ensure complete curing. The dynamic balance between viscosity and reactivity is achieved through the specific molecular structure and functional groups of the amine compound

Inventive Principle:
Principle #15Dynamics

3Manufacturing precision

If high-viscosity epoxy resin is used, then resin outflow is suppressed, but thermosetting time increases

Engineering Contradiction:
Improveresin outflow controlVSAvoidthermosetting time
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

The patent changes the chemical reaction parameters by selecting an amine compound with specific reactivity characteristics. The amine compound maintains high resin viscosity to control outflow while its functional groups and molecular structure are optimized to provide adequate curing speed. The balance between viscosity control and curing kinetics is achieved through precise selection of the amine compound's chemical parameters

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The prepreg achieves excellent storage stability, shorter thermosetting times, and high heat tolerance, reducing defects and improving productivity in fiber-reinforced composite materials.

Implementation Method 1

A prepreg composed of an epoxy resin composition containing specific components such as imidazole compounds and sulfur-containing epoxy resins

Methodology Applied
Scientific EffectChemical reaction: Chemical Bonding

Data Source

PatentUS10227476B2Prepreg, fiber-reinforced composite material, method for producing same, and epoxy resin composition
Publication Date: 2019.03.12 MITSUBISHI CHEM CORP
  • US10227476B2 patent drawing
  • US10227476B2 patent drawing
  • US10227476B2 patent drawing

AI summary

The present invention pertains to a prepreg containing reinforcing fibers and an epoxy resin composition. Said prepreg is sandwiched between dies preheated to 140.degree.C. and pressurized to MPa and held for five minutes at this temperature to obtain a cured article having a G′Tg of at least 150.degree.C. The present invention also pertains to a fiber-reinforced composite material and a method for producing same. According to this invention, it is possible to provide a prepreg which is well suited to press-molding, particularly to high-cycle press-molding. It is also possible to provide a fiber-reinforced composite material which can be heat-cured at a lower temperature and over a shorter time than conventional methods, with which it is possible to minimize excessive flow of resin in hot-press curing, and which is resistant to performance defects such as fiber meandering and defects in surface appearance. A method for producing the same can also be provided.