Epoxy Resin Composition for Copper Wire Adhesion and Thermal Stability
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Solution Overview
Problem
Electronic component devices using copper wires face inadequate high-temperature storage characteristics, necessitating a resin composition that balances adhesion and thermal stability for effective sealing.
Innovation Solution
A resin composition comprising an epoxy resin, a phenolic resin-based curing agent, an inorganic filler, and a specific compound with a hydroxybenzoyl group, along with a silane coupling agent containing a mercapto group, and a curing accelerator as an adduct of a phosphine compound and a quinone compound, optimized for content ratios to enhance adhesion and high-temperature storage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a mercapto group-containing compound is added to improve adhesion, then adhesion is improved, but high-temperature storage characteristics deteriorate
Solution Approach 1:
The patent changes the chemical structure parameters of the coupling agent by introducing a specific compound with formula (1) containing a hydroxybenzoyl group and controlled mercapto group content (0.01-1 mass%). This structural modification allows the material to achieve both improved adhesion and acceptable high-temperature storage characteristics by optimizing the balance between reactive functional groups and thermal stability
Solution Approach 2:
The patent creates a composite resin composition system combining epoxy resin, phenolic resin-based curing agent, inorganic filler, and the specially designed compound (1). This composite approach allows the different components to work synergistically, where the compound (1) provides adhesion enhancement while the epoxy-phenolic matrix maintains thermal stability
2Ease of manufacture
If copper wire is used instead of gold to reduce cost, then manufacturing cost is reduced, but high-temperature storage characteristics deteriorate
Solution Approach 1:
The compound (1) acts as an intermediary between the copper wire and the epoxy resin matrix. It provides a chemical bridge that enhances the interface bonding between copper and resin, preventing direct degradation reactions at high temperatures while maintaining electrical conductivity and mechanical strength
Solution Approach 2:
The patent modifies the chemical environment at the copper-resin interface by introducing compound (1) with specific functional groups. This changes the interfacial chemistry to be more resistant to high-temperature degradation, allowing copper wire to maintain reliability in elevated temperature applications
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves both sufficient adhesion and excellent high-temperature storage characteristics, ensuring the stability and performance of electronic component devices, particularly when using copper wires.
Implementation Method 1
an epoxy resin (A), a curing agent (B), and a curing accelerator (F) which is an adduct of a phosphine compound and a quinone compound
Implementation Method 2
a silane coupling agent (E1) having a mercapto group
Data Source
Figure 1
AI summary
A resin composition for sealing of the present invention contains an epoxy resin (A), a curing agent (B), an inorganic filler (C), and a compound (D) represented by Formula (1). In Formula (1), R1 represents a polar group or a hydrocarbon group. An electronic component device (10) of the present invention has an electronic component (11) and a sealing material (12) sealing the electronic component (11), in which the sealing material (12) is a cured substance of the resin composition for sealing.