Epoxy Resin Curing via Latent Amine Adduct for Wind Blade Performance

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Solution Overview

Problem

Current epoxy resin materials used in wind power blades face challenges such as short operation time, high exothermic peak temperatures, and poor mechanical and heat resistance properties, making them unsuitable for large-scale applications.

Innovation Solution

A method involving the use of an adduct of an olefinic nitrile compound and an amine compound, which undergoes a ring-opening addition reaction to form an N-hydrocarbyl cyanoguanidine and subsequent amide bond structure, improving heat resistance, solvent resistance, and mechanical properties when the mixture is heated between 40-85°C.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If a common amine curing agent is used in epoxy resin materials, then the curing speed is fast, but the operation time after mixing is short and the resin cannot flow fully in the mold

Engineering Contradiction:
Improvecuring speedVSAvoidoperation time
Core Design Contradiction:
SpeedVSDuration of action of moving object

Solution Approach 1:

The patent introduces a latent curing agent that changes its reactivity parameters based on temperature. At low temperatures (room temperature), the curing agent has low reactivity allowing long operation time and full resin flow. When heated to higher temperatures (80-150°C), the curing agent becomes highly reactive providing fast curing speed. This temperature-dependent parameter change resolves the contradiction between fast curing and long operation time.

Inventive Principle:
Principle #35Parameter changes

2Duration of action of moving object

If a latent curing agent with low reactivity is used to extend operation time, then the operation time is extended, but the post-curing temperature is high and the cured product has poor mechanical properties

Engineering Contradiction:
Improveoperation timeVSAvoidmechanical properties
Core Design Contradiction:
Duration of action of moving objectVSStrength

Solution Approach 1:

The patent uses a latent curing agent whose reactivity parameter changes with temperature. At low temperatures, it provides low reactivity for extended operation time. Upon heating to 80-150°C, the reactivity increases dramatically enabling complete curing and achieving excellent mechanical properties (tensile strength ≥50MPa, flexural strength ≥80MPa). This dynamic parameter adjustment resolves the contradiction between operation time and mechanical properties.

Inventive Principle:
Principle #35Parameter changes

3Speed

If the activity of the curing agent is reduced by modifying an epoxy compound or organosilicone, then the reactivity is reduced, but the viscosity of the curing agent becomes high and the degree of activity reduction is small

Engineering Contradiction:
ImprovereactivityVSAvoidviscosity
Core Design Contradiction:
SpeedVSEase of manufacture

Solution Approach 1:

The patent employs a latent curing agent where reactivity is controlled by temperature rather than molecular structure modification. The curing agent maintains low viscosity throughout the process because its reactivity change is achieved through thermal activation of the latent agent, not through adding bulky modifying groups that would increase viscosity. This resolves the contradiction between reducing reactivity and maintaining low viscosity.

Inventive Principle:
Principle #35Parameter changes

4Speed

If microencapsulation is used to produce a low activity curing agent, then the curing agent can be quickly cured by heating, but it has poor compatibility with epoxy resin and requires high post-curing temperature with low mechanical properties

Engineering Contradiction:
Improvecuring speedVSAvoidmechanical properties
Core Design Contradiction:
SpeedVSStrength

Solution Approach 1:

The patent uses a latent curing agent that achieves temperature-dependent reactivity without microencapsulation. The latent curing agent maintains good compatibility with epoxy resin and achieves high mechanical properties (tensile strength ≥50MPa, flexural strength ≥80MPa) when cured at 80-150°C. The temperature-dependent reactivity is achieved through molecular design of the latent agent itself, not through encapsulation, thereby avoiding the compatibility and mechanical property issues associated with microencapsulation.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution extends pot life, reduces exothermic peak temperatures, and enhances mechanical and heat resistance properties, allowing for the production of epoxy resin materials suitable for large-scale wind power blades with improved performance and durability.

Implementation Method 1

A method involving the use of an adduct of an olefinic nitrile compound and an amine compound, which undergoes a ring-opening addition reaction to form an N-hydrocarbyl cyanoguanidine and subsequent amide bond structure

Methodology Applied
Scientific EffectRing-opening addition reaction: Chemical Bonding

Implementation Method 2

when the mixture is heated between 40-85°C

Methodology Applied
Scientific EffectThermal heating: Heating

Data Source

PatentUS11248085B2Epoxy resin material, preparation method therefor and application thereof
Publication Date: 2022.02.15 WANHUA CHEM GRP CO LTD
  • US11248085B2 patent drawing
  • US11248085B2 patent drawing
  • US11248085B2 patent drawing

AI summary

The present invention provides an epoxy resin material, a preparation method therefor and an application thereof. The present method for preparing an epoxy resin material comprises: heating a mixture of an epoxy resin main agent and a curing agent that are placed at room temperature to 40-85° C. for reaction and curing. The curing agent contains an adduct of an olefinic nitrile compound and an amine compound. The present method for preparing an epoxy resin material has the characteristics of low mixing viscosity, long operation time, and low amount of heat released during preparation.