Epoxy Resin Composition for Low-Temperature Curing Stability
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Solution Overview
Problem
Epoxy resin compositions face a trade-off between increased reactivity and thickening, making it difficult to formulate a composition that achieves both excellent storage stability and curability while being curable at low temperatures.
Innovation Solution
Incorporating an aluminum chelate compound and a silane compound with a phenyl group into an epoxy resin composition containing a non-silicone-modified epoxy resin, an aromatic amine curing agent, and a silicone-modified epoxy resin, along with an inorganic filler, to create a composite catalyst system that promotes curing at low temperatures without significant thickening.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a curing accelerator is added to increase curability, then the curing rate increases, but the epoxy resin thickens at room temperature and pot life shortens
Solution Approach 1:
The patent changes the chemical parameters of the catalyst system by using a composite catalyst consisting of metal complex and silane compound instead of conventional single-component accelerators. This parameter change enables the system to maintain low reactivity at room temperature while achieving high curing rates when activated, thereby resolving the contradiction between storage stability and curing rate.
Solution Approach 2:
The patent applies composite catalyst system comprising metal complex and silane compound components that work synergistically. The composite structure allows the system to remain stable during storage while providing effective catalysis during curing, thus solving the contradiction between maintaining storage stability and achieving high productivity.
2Temperature
If a curing accelerator is added to enable low-temperature curing, then the curing temperature decreases, but the epoxy resin thickens and pot life is reduced
Solution Approach 1:
The patent modifies the catalytic parameters by introducing a composite catalyst system that exhibits temperature-dependent activity. The metal complex-silane compound combination allows the system to remain inactive at room temperature (maintaining pot life) while becoming highly active at elevated temperatures (enabling low-temperature curing), thus resolving the contradiction between curing temperature and pot life.
Solution Approach 2:
The patent creates a dynamic catalyst system where the composite catalyst (metal complex + silane compound) remains dormant during storage but becomes activated during the curing process. This dynamic behavior allows the system to provide long pot life while achieving effective low-temperature curing when needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting epoxy resin composition exhibits excellent storage stability with a long pot life and rapid curing at low temperatures, while maintaining good mechanical properties.
Implementation Method 1
adding an aluminum chelate compound and a silane compound having a phenyl group to an epoxy resin composition containing an epoxy resin and an aromatic amine curing agent, thereby completing the present invention
Data Source
AI summary
One of the purposes of the present invention is to provide an epoxy resin composition having excellent storage stability and curability while being curable at a low temperature in a short period of time. The present invention provides an epoxy resin composition comprising: (A) a non-silicone-modified epoxy resin having two or more epoxy groups per molecule; (B) an aromatic amine-based curing agent having two or more amino groups per molecule, in an effective amount for curing the epoxy resin; (C) a silicone-modified epoxy resin, in an amount of 1 to 200 parts by mass, relative to 100 parts by mass of component (A); (D) an aluminum chelate compound, in an amount of 0.05 parts by mass or more and less than 3.0 parts by mass, relative to 100 parts by mass of the total of components (A), (B), and (C); (E) at least one selected from an alkoxysilane having one or more phenyl groups per molecule and one or more alkoxy groups per molecule, and a partially hydrolyzed condensate of the alkoxysilane, in an amount of 0.5 parts by mass or more and less than 3.0 parts by mass, relative to 100 parts by mass of the total of components (A), (B), and (C); and (F) an inorganic filler, in an amount of 10 parts by mass or more and 1,000 parts by mass or less, relative to 100 parts by mass of the total of components (A), (B), and (C).