Epoxy Resin Composition for Low Dissipation Factor Laminates
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional epoxy resin compositions for laminates often fail to meet modern specifications for high-frequency electrical insulating properties, particularly in printed circuit boards, where they lack balanced physical and electrical performance.
Innovation Solution
A thermosettable epoxy resin composition is developed, comprising an epoxy resin, epoxidized cycloaliphatic dicyclopentadiene phenolic resin, optional epoxidized bisphenol-A novolac resin, oligomeric butadiene, organic solvent, and an alkylphenol novolac resin as a curing agent, which, when cured, achieves a low dissipation factor (Df) of about 0.023 or less and a dielectric constant (Dk) of about 3.2 or less at 1 GHz.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional epoxy resin compositions are used for laminates, then manufacturing process is simple and physical properties are adequate, but electrical insulating properties at high frequencies are insufficient
Solution Approach 1:
The patent employs a composite resin system combining epoxidized dicyclopentadiene phenolic resin with conventional epoxy resin and novolac curing agent. This composite formulation achieves superior high-frequency electrical insulating properties (Df ≤ 0.023, Dk ≤ 3.2 at 1 GHz) while maintaining adequate physical properties, resolving the contradiction between electrical performance and formulation simplicity.
Solution Approach 2:
The patent modifies the chemical composition parameters by incorporating epoxidized dicyclopentadiene phenolic resin at specific weight ratios (30-70 wt% of total resin), which fundamentally changes the electrical properties of the cured laminate. This parameter change enables achieving low dissipation factor and dielectric constant while maintaining structural integrity.
2Temperature
If high Tg epoxy resin systems are used to improve heat resistance and reduce thermal expansion, then electrical properties at high frequencies may not be sufficient
Solution Approach 1:
The patent creates a composite system where epoxidized dicyclopentadiene phenolic resin (providing high Tg and heat resistance) is combined with conventional epoxy resin. This composite approach ensures both thermal performance (high heat resistance) and electrical performance (low Df and Dk at 1 GHz) are achieved simultaneously, resolving the contradiction between thermal and electrical properties.
3Reliability
If conventional epoxy resin compositions are used, then formulation is simple, but balanced physical and electrical performance is not achieved
Solution Approach 1:
The patent develops a balanced composite formulation combining epoxidized dicyclopentadiene phenolic resin, conventional epoxy resin, and novolac curing agent in specific ratios. This composite system achieves both adequate physical properties (strength, rigidity) and superior electrical properties (low dissipation factor and dielectric constant), providing balanced performance that conventional single-resin systems cannot achieve.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition provides superior electrical insulating properties while maintaining physical properties comparable to conventional laminates, enhancing the performance of printed circuit boards and other composite structures.
Implementation Method 1
an alkylphenol novolac resin, the alkylphenol novolac resin serving as a curing agent
Data Source
AI summary
A composite prepared using a thermosettable epoxy resin composition having, as components: (1) an epoxy resin; (2) an epoxidized cycloaliphatic dicyclopentadiene phenolic resin; (3) an optional epoxidized bisphenol-A novolac resin; (4) an optional oligomeric butadiene; (5) an optional organic solvent; and (6) an alkylphenol novolac resin, the alkylphenol novolac resin serving as a curing agent. The composite so prepared may have good physical properties and superior a electrical properties as compared to conventional composites, such as laminates. The prepregs used to make the laminates may have a better surface appearance as well.