Epoxy Resin Composition Flame Retardance Hole Position Accuracy
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing epoxy resin compositions for printed circuit boards face challenges in achieving excellent flame retardance, heat resistance, and thermal stiffness without using halogen-based compounds, while maintaining accurate hole position precision, especially with the increasing complexity of modern printed circuit boards.
Innovation Solution
An epoxy resin composition for prepregs, comprising a phosphorus compound with specific phenolic hydroxyl groups, a bifunctional epoxy resin, a multi-functional epoxy resin, a hardening agent, an inorganic filler, and a molybdenum compound, blended in specific ratios and forms, to create a pre-reacted epoxy resin that enhances glass transition temperature, flame retardance, and thermal stiffness, while ensuring accurate hole positioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If 110 parts or more by mass of inorganic filler is added with respect to 100 parts by mass of epoxy resin composition to achieve flame retardance and heat resistance, then flame retardance and heat resistance are improved, but hole position accuracy deteriorates due to large variation in hole position at the time of process
Solution Approach 1:
The patent changes the chemical composition parameters of the epoxy resin system by introducing a phosphorus-containing phenolic compound as a reactive component. This chemical modification allows the resin to achieve flame retardance through its molecular structure rather than relying solely on high inorganic filler content, thereby maintaining hole position accuracy while achieving the required flame retardant performance
Solution Approach 2:
The patent creates a composite epoxy resin system combining phosphorus-containing phenolic compounds with epoxy resins and curing agents. This composite material approach provides both flame retardant properties through the phosphorus content and maintains good processability and hole position accuracy by optimizing the resin matrix composition
2Temperature
If inorganic filler content is increased to improve heat resistance without halogen-based compounds, then flame retardance is improved, but thermal stiffness and hole position accuracy cannot be simultaneously optimized
Solution Approach 1:
The patent modifies the resin composition parameters by incorporating phosphorus-containing phenolic compounds that contribute to heat resistance through their chemical structure. This allows achieving the required heat resistance and flame retardance without excessively increasing inorganic filler content, thereby maintaining thermal stiffness and hole position accuracy
3Object-affected harmful factors
If conventional epoxy resin composition is used to achieve flame retardance without halogen-based compounds, then environmental safety is improved, but thermal stiffness decreases due to higher reflow temperature from lead free solder
Solution Approach 1:
The patent changes the thermal and mechanical parameters of the epoxy resin system by introducing phosphorus-containing phenolic compounds. This chemical modification increases the glass transition temperature and thermal stiffness of the cured resin, enabling it to withstand the higher reflow temperatures of lead-free soldering processes while maintaining flame retardance without halogen-based compounds
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves stable and enhanced flame retardance, heat resistance, thermal stiffness, and hole position accuracy, with improved adhesion and resistance to thermal stress, making it suitable for high-performance multilayer printed circuit boards.
Implementation Method 1
a phosphorus compound that has, on average, 1.8 or more and less than 3 phenolic hydroxyl groups that are reactive to an epoxy resin
Implementation Method 2
to have excellent heat resistance without generation of delamination at a temperature where lead free solder is treated
Implementation Method 3
to have excellent flame retardance without addition of a halogen-based compound as a flame retardant
Data Source
AI summary
The problem to be solved by the invention is to provide an epoxy resin composition for a prepreg, which is used in the manufacture of a printed circuit board containing a multilayer printed circuit board, wherein the epoxy resin composition for a prepreg is characterized by containing as essential components, a phosphorus compound that has 1.8 or more and less than 3 on average of a phenolic hydroxyl group that is reactive to an epoxy resin in the molecule, and that has 0.8 or more on average of a phosphorus element; a bifunctional epoxy resin that has 1.8 or more and less than 2.6 on average of epoxy groups in the molecule; a multi-functional epoxy resin that contains 2.8 or more on average of epoxy groups in one molecule; a hardening agent; an inorganic filler; and a molybdenum compound, wherein the epoxy resin composition for a prepreg is obtained by blending a pre-reacted epoxy resin, which is obtained by reacting at least the phosphorus compound with the bifunctional epoxy resin and the multi-functional epoxy resin, or the bifunctional epoxy resin only in advance, the bifunctional epoxy resin or the multi-functional epoxy resin, the hardening agent, the inorganic filler, and the molybdenum compound, which is excellent in flame retardance, heat resistance, thermal stiffness, and excellent in hole position accuracy without the production of a harmful substance at the time of combustion, a prepreg using the epoxy resin composition for a prepreg, and a multilayer printed circuit board using the prepreg.