Epoxy Resin Composition for High-Tg Electronic Component Packaging
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Solution Overview
Problem
Epoxy resin compositions used in electronic components exhibit a high glass transition temperature but suffer from significant decreases in elastic modulus at elevated temperatures, compromising their reliability under high-temperature environments.
Innovation Solution
A composition combining a trisphenolmethane type epoxy resin with a naphthalenediol aralkyl phenol resin and a dihydroxynaphthalene compound, along with an antioxidant, to maintain high glass transition temperature and minimize changes in elastic modulus and mass at high temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a trisphenolmethane type epoxy resin is used to elevate glass transition temperature, then high heat resistance is achieved, but the elastic modulus significantly decreases at near 200°C
Solution Approach 1:
The patent combines trisphenolmethane type epoxy resin with naphthalenediol aralkyl phenol resin to create a composite resin system. This composite approach allows the material to achieve both high glass transition temperature (heat resistance) and maintain adequate elastic modulus at elevated temperatures, resolving the contradiction between these two properties.
2Temperature
If a trisphenolmethane type epoxy resin is used to elevate glass transition temperature, then high heat resistance is achieved, but reliability under high temperature environment is insufficient
Solution Approach 1:
By formulating a composite resin system combining trisphenolmethane type epoxy resin with naphthalenediol aralkyl phenol resin, the patent achieves both elevated glass transition temperature and improved reliability under high temperature conditions. The synergistic effect of the composite materials ensures stable physical properties at temperatures around 200°C.
Solution Approach 2:
The patent optimizes the compositional parameters of the resin system, specifically controlling the ratios of epoxy resin to phenol resin and adjusting molecular weight distributions. These parameter changes enable the material to maintain both high glass transition temperature and excellent high-temperature reliability.
3Ease of manufacture
If conventional epoxy resin compositions are used, then ease of manufacture is maintained, but changes in physical properties under high temperature are significant
Solution Approach 1:
The patent employs a composite resin system that can be manufactured using conventional processes while achieving superior thermal stability. The naphthalenediol aralkyl phenol resin component maintains ease of manufacture through standard curing procedures, while simultaneously reducing physical property changes at high temperatures.
Data Source
AI summary
An epoxy resin composition includes: (A) an epoxy resin containing a compound represented by the following Formula (I); (B) a phenol resin containing a compound represented by the following Formula (II); and (C) a dihydroxynaphthalene compound containing a compound represented by the following Formula (III). In Formula (I), R represents a hydrogen atom, and n represents an integer from 0 to 10. In Formula (II), R1 represents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, or an alkoxy group having 1 or 2 carbon atoms, and each R1 may be the same as or different from another R1. n represents an integer from 0 to 10. In Formula (III), R1 represents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, or an alkoxy group having 1 or 2 carbon atoms.