Epoxy Resin Composition Latent Curing Accelerator
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Solution Overview
Problem
Existing epoxy resin compositions for encapsulating semiconductor devices face challenges with room temperature storage stability, flowability, and curing properties, often resulting in increased viscosity and deterioration of mechanical, electrical, and chemical properties during high-temperature molding, which complicates handling and packaging reliability.
Innovation Solution
An epoxy resin composition incorporating a 4-valent ammonium or phosphonium salt as a curing accelerator, combined with specific epoxy resins and inorganic fillers, enhances curing strength, flowability, and storage stability, while maintaining mechanical integrity and preventing cracking and peeling issues during high-temperature processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional epoxy resin composition is used for transfer molding, then low cost and ease of mass production are achieved, but room temperature storage stability and curing properties deteriorate due to partial curing reactions
Solution Approach 1:
A latent curing accelerator is introduced as an intermediary substance that remains inactive during storage and only activates under specific curing conditions. This mediator prevents premature curing reactions while maintaining storage stability, resolving the contradiction between ease of manufacture and storage stability
Solution Approach 2:
The curing acceleration characteristic is changed by introducing a latent accelerator that only becomes active under specific temperature and time conditions. This parameter change allows the composition to remain stable during storage while achieving proper curing during the molding process
2Ease of manufacture
If conventional epoxy resin composition is used, then transfer molding is simplified, but flowability and viscosity control deteriorate leading to manufacturing issues
Solution Approach 1:
The composition is prepared with pre-measured components and proper viscosity characteristics before molding. The latent curing accelerator is incorporated in advance but remains inactive, ensuring proper flowability during molding while preventing premature curing that would compromise manufacturing precision
3Ease of manufacture
If conventional epoxy resin composition is used, then production cost is reduced, but mechanical and chemical properties deteriorate due to partial curing
Solution Approach 1:
The latent curing accelerator acts as a controlled intermediary that ensures complete curing under proper conditions while preventing premature reactions. This maintains cost-effectiveness while improving mechanical and chemical properties by eliminating the detrimental effects of partial curing
Solution Approach 2:
The curing parameters are optimized by using a latent accelerator that activates only under specific temperature and time conditions. This ensures complete curing and maximum material properties while maintaining cost-effective production processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition exhibits superior flowability, room temperature storage stability, and curing strength, ensuring reliable encapsulation of semiconductor devices with improved crack resistance and moisture resistance, thus addressing the limitations of previous formulations.
Implementation Method 1
an epoxy resin; a curing agent; a curing accelerator; and an inorganic filler, wherein the curing accelerator includes a 4-valent ammonium salt or a 4-valent phosphonium salt
Data Source
AI summary
An epoxy resin composition includes: an epoxy resin; a curing agent; a curing accelerator; and an inorganic filler, wherein the curing accelerator includes a 4-valent ammonium salt or a 4-valent phosphonium salt represented by Formula 1,wherein A1 is nitrogen or phosphorus; R1, R2, R3 and R4 are each independently a substituted or unsubstituted C1 to C30 hydrocarbon group, or a substituted or unsubstituted C1 to C30 hydrocarbon group including a hetero atom; X1, X2, X3, X4, X5 and X6 are each independently an oxygen atom (O), a sulfur atom (S), or NH; and Y1, Y2 and Y3 are each independently a substituted or unsubstituted C1 to C30 hydrocarbon group, or a substituted or unsubstituted C1 to C30 hydrocarbon group including a hetero atom.