Thermosetting Epoxy Resin Composition for LED PCBs
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Solution Overview
Problem
Existing laminates and printed circuit boards used in LED applications lack high whiteness, heat discoloration resistance, dimensional stability, and flame retardancy, which are essential for meeting the performance requirements in LED and other fields.
Innovation Solution
A thermosetting epoxy resin composition is developed, comprising a phosphorus-containing anhydride, a phosphorus-free anhydride, an epoxy resin, a filler, and an optional phosphorus-containing flame retardant, which together provide V0 grade flame retardancy, high heat discoloration resistance, and dimensional stability while maintaining high whiteness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If conventional epoxy resin compositions are used to achieve high whiteness and adhesion, then the laminate shows good initial appearance and bonding strength, but the laminate discolors severely after high temperature treatment and lacks flame retardancy
Solution Approach 1:
The patent changes the chemical composition parameters of the epoxy resin system by introducing phosphorus-containing anhydride (2-10 parts) and phosphorus-containing flame retardant (0-15 parts) into the conventional epoxy resin composition. This parameter modification enables the resin to achieve both high whiteness and excellent heat discoloration resistance while providing V0 grade flame retardancy, resolving the contradiction between initial appearance and high-temperature stability.
Solution Approach 2:
The patent creates a composite resin system combining multiple components: phosphorus-containing anhydride, phosphorus-free anhydride (5-40 parts), epoxy resin (5-45 parts), filler (40-70 parts), and phosphorus-containing flame retardant. This composite material approach integrates the benefits of each component to achieve simultaneous improvement in whiteness, heat resistance, and flame retardancy that cannot be obtained by single-material systems.
2Object-affected harmful factors
If flame retardant additives are added to achieve V0 grade flame retardancy, then the laminate meets safety requirements, but the dimensional stability and heat discoloration resistance deteriorate
Solution Approach 1:
The patent optimizes the concentration parameter of phosphorus-containing flame retardant within the range of 0-15 parts, and combines it with phosphorus-containing anhydride (2-10 parts) to achieve V0 grade flame retardancy. This parameter optimization ensures that the flame retardant level is sufficient for safety while maintaining dimensional stability and heat discoloration resistance, avoiding the deterioration caused by excessive additive amounts.
Solution Approach 2:
The phosphorus-containing anhydride acts as an intermediary substance that bridges the flame retardant and the epoxy resin matrix. It facilitates the integration of phosphorus-containing flame retardant into the resin system, enabling effective flame retardancy while maintaining dimensional stability through its role in the crosslinked network structure.
3Stability of the object's composition
If high filler content is added to improve dimensional stability and heat resistance, then the laminate achieves better thermal performance, but the whiteness and adhesion properties deteriorate
Solution Approach 1:
The patent optimizes the filler content parameter within the range of 40-70 parts, and combines it with specific ratios of phosphorus-containing anhydride (2-10 parts) and phosphorus-free anhydride (5-40 parts). This parameter optimization ensures sufficient dimensional stability and heat resistance while maintaining high whiteness and adhesion properties, avoiding the deterioration caused by excessive filler addition.
Data Source
AI summary
Provided are a thermosetting epoxy resin composition and a prepreg, laminated board and printed circuit board using the thermosetting epoxy resin composition. The thermosetting epoxy resin composition comprises the following components in parts by weight: 2-10 parts of a phosphorus-containing anhydride, 5-40 parts of a phosphorus-free anhydride, 5-45 parts of an epoxy resin, 40-70 parts of a filler, and 0-15 parts of a phosphorus-containing flame retardant, with the total part by weight of all these components being 100 parts, wherein the phosphorus-containing anhydride has a structure as represented by formula I or II, and the epoxy resin is selected from one of or a combination of at least two of a bisphenol A epoxy resin, a bisphenol F epoxy resin and a biphenyl epoxy resin. The thermosetting epoxy resin composition also has good heat resistance, discoloration resistance and dimensional stability after curing while ensuring V-0 grade flame resistance, and can be used for the preparation of printed circuit board substrates in the field of LEDs.