Epoxy Resin Composition for Low-Temperature FRP Curing
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Solution Overview
Problem
Existing fiber-reinforced composite materials (FRPs) face high manufacturing costs due to the need for high-temperature and high-pressure curing processes, which are inefficient and costly, and there is a lack of materials that can achieve equivalent quality and reliability at lower temperatures and pressures.
Innovation Solution
A resin composition comprising specific amounts of epoxy resins, aromatic diamine compounds, dicyandiamide, urea compounds, and amine adduct compounds, allowing for curing at 120°C and post-curing at atmospheric pressure to achieve equivalent heat resistance and mechanical properties to traditional 180°C curing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional epoxy resin composition is used for FRP manufacturing, then sufficient heat resistance and mechanical properties can be achieved, but high manufacturing cost is incurred due to high-temperature and high-pressure curing requirements
Solution Approach 1:
The patent modifies the chemical composition parameters of the epoxy resin system by introducing a specific blend of aromatic diamine compound, dicyandiamide, urea compound, and amine adduct compound. This compositional parameter change enables the curing process to occur at lower temperatures (120°C instead of 180°C) and pressures, thereby reducing manufacturing costs while maintaining the required heat resistance and mechanical properties of the FRP
2Reliability
If high-temperature curing at 180°C is used to achieve sufficient heat resistance, then equivalent quality to 120°C curing can be obtained, but manufacturing cost increases due to higher energy consumption and equipment requirements
Solution Approach 1:
The patent changes the chemical parameters of the curing system to enable effective curing at 120°C, which significantly reduces energy consumption compared to 180°C curing. The specific blend of curing agents (aromatic diamine compound, dicyandiamide, urea compound, and amine adduct compound) is designed to achieve complete curing and equivalent heat resistance at the lower temperature, thereby reducing energy costs while maintaining product quality
3Strength
If traditional epoxy resin composition is used, then adequate mechanical properties are achieved, but manufacturing complexity increases due to requirement of autoclave equipment and auxiliary materials
Solution Approach 1:
The patent modifies the resin composition parameters to enable low-temperature curing that does not require autoclave equipment. The modified epoxy resin system with specific curing agents can be processed using simpler equipment and methods, reducing the complexity of manufacturing facilities and auxiliary materials needed while maintaining adequate mechanical properties through optimized composition ratios
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition enables cost-effective manufacturing by reducing the need for autoclave equipment and auxiliary materials, while maintaining or improving the quality and performance of the composite materials.
Implementation Method 1
an epoxy resin composition for a fiber-reinforced composite material, including: (a) one or more epoxy resins; (b) an aromatic diamine compound; (c) a dicyandiamide; (d) a urea compound; and (e) an amine adduct compound
Data Source
AI summary
An epoxy resin composition for a fiber-reinforced composite material includes: (a) one or more epoxy resins; (b) an aromatic diamine compound; (c) a dicyandiamide; (d) a urea compound; and (e) an amine adduct compound, blended in specific ranges.