Epoxy Resin Composition with Microcapsule Accelerator
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Solution Overview
Problem
Epoxy resin compositions face challenges in achieving both curability and storage stability while maintaining sufficient adhesive strength, particularly due to the introduction of allyl groups in phenol-based curing agents which reduce reactivity and require high temperatures and long curing times.
Innovation Solution
The composition includes a liquid phenolic resin with an aliphatic carbon-carbon double bond, a microcapsule-type curing accelerator, and an imidazole compound with a triazine ring, along with an inorganic filler, to enhance curability, storage stability, and adhesive strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If an allyl group is introduced into the phenol-based curing agent to create liquid phenolic resin, then the resin remains liquid at room temperature and moisture resistance reliability is improved, but the reactivity of phenolic hydroxyl groups decreases and high temperature and long curing time are required
Solution Approach 1:
A microcapsule-type curing accelerator is introduced as an intermediary substance that contains and releases curing accelerator agents. The microcapsules protect the accelerator agents from premature reaction while enabling controlled release during curing, thus improving the reactivity of the liquid phenolic resin without sacrificing its liquid state or moisture resistance properties
Solution Approach 2:
The patent changes the physical and chemical parameters of the curing system by introducing compounds with specific functional groups (carboxyl, hydroxyl, amino groups) and controlling their content ratios. This allows optimization of curing speed while maintaining the liquid state and moisture resistance of the phenolic resin
2Productivity
If a microcapsule-type curing accelerator is added to improve curability, then curing speed is enhanced, but storage stability becomes difficult to maintain
Solution Approach 1:
The curing accelerator agents are segmented and enclosed within microcapsule structures. This segmentation isolates the accelerators from the main resin system during storage, preventing premature reaction and maintaining stability. During curing, the microcapsules rupture and release the accelerators, enabling fast curing when needed
Solution Approach 2:
The curing accelerator agents are nested within the microcapsule structures, creating a hierarchical system where the accelerators are contained within the capsule matrix. This nested structure protects the accelerators during storage while enabling their controlled release during the curing process
3Productivity
If the reactivity of phenolic hydroxyl groups is improved by using catalysts, then curing speed increases, but storage stability and adhesive strength remain insufficient
Solution Approach 1:
The patent creates a composite curing system combining liquid phenolic resin with microcapsule-type curing accelerator and specific imidazole compounds. This composite approach integrates multiple functional components that work synergistically to achieve fast curing, storage stability, and excellent adhesive strength simultaneously
Solution Approach 2:
The patent optimizes the chemical composition parameters by introducing imidazole compounds with triazine rings and controlling the content ratios of carboxyl, hydroxyl, and amino groups. These parameter changes enhance adhesive strength and storage stability while maintaining improved curing speed
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This combination results in an epoxy resin composition with excellent curability, storage stability, and adhesive strength, suitable for use in electronic and automotive applications.
Implementation Method 1
a microcapsule-type curing accelerator
Implementation Method 2
microcapsule-type curing accelerator
Implementation Method 3
an imidazole compound having a triazine ring
Implementation Method 4
epoxy resin compositions generally comprises curing agents that react with epoxy groups
Data Source
AI summary
One of the objects of the present invention is to provide an epoxy resin composition that has excellent curability and storage stability, and that gives a cured product with excellent adhesive strength. The present invention provides an epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin in a form of liquid at 25° C., having, per molecule, one or more functional groups having an aliphatic carbon-carbon double bond, (C) a microcapsule-type curing accelerator, (D) an imidazole compound having a triazine ring, and (E) an inorganic filler.