Epoxy Resin Optical Component for High Thickness Deviation
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Solution Overview
Problem
Existing optical components, such as Fresnel lenses, face challenges in achieving high thickness deviation ratios with thermoplastic resins, which result in poor mechanical strength, heat resistance, and appearance due to low fluidity and filling issues, and silicones offer high cost and poor shape transferability.
Innovation Solution
A curable composition containing an epoxy compound, oxetane compound, and cationic-polymerization initiator, subjected to cast molding, which provides a molded article with high thickness deviation ratios, excellent mechanical strength, heat resistance, and mold transferability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If thermoplastic resins are used for injection molding to produce molded articles with high thickness deviation ratios, then production efficiency is improved, but mechanical strength and appearance deteriorate due to low fluidity and filling issues
Solution Approach 1:
The patent changes the material parameter from thermoplastic resin to thermosetting resin, which fundamentally alters the fluidity and curing characteristics. Thermosetting resins maintain fluidity during molding and then cure in place, allowing high thickness deviation ratios to be achieved without the filling problems that plague thermoplastic materials, thereby resolving the contradiction between production efficiency and mechanical strength
Solution Approach 2:
The patent employs composite material formulation by combining thermosetting resin with specific additives and modifiers that enhance both fluidity for complex shape filling and final cured strength. This composite approach allows the material to exhibit optimal properties for both the molding process and the final product performance, addressing the mechanical strength deterioration issue
2Productivity
If thermoplastic resins are used for injection molding to produce molded articles with high thickness deviation ratios, then production efficiency is improved, but appearance deteriorates due to unfilled parts and weld lines
Solution Approach 1:
The patent changes the material parameter from thermoplastic resin to thermosetting resin, which fundamentally alters the fluidity and curing characteristics. Thermosetting resins maintain fluidity during molding and then cure in place, allowing high thickness deviation ratios to be achieved without the filling problems that plague thermoplastic materials, thereby resolving the contradiction between production efficiency and mechanical strength
Solution Approach 2:
The patent employs composite material formulation by combining thermosetting resin with specific additives and modifiers that enhance both fluidity for complex shape filling and final cured strength. This composite approach allows the material to exhibit optimal properties for both the molding process and the final product performance, addressing the mechanical strength deterioration issue
3Temperature
If silicones are used to achieve high thickness deviation ratios and heat resistance, then heat resistance is improved, but material cost increases and shape transferability deteriorates
Solution Approach 1:
The patent changes the material parameter from silicone to thermosetting resin, which offers comparable heat resistance through its crosslinked network structure but with superior moldability. The thermosetting resin maintains fluidity during the molding process, enabling excellent shape transferability to complex molds that silicone cannot achieve, thus resolving the contradiction between heat resistance and shape transferability
4Productivity
If thermoplastic resins are used for injection molding, then production efficiency is improved, but the molded articles cannot withstand reflow soldering temperatures
Solution Approach 1:
The patent changes the material parameter from thermoplastic resin to thermosetting resin, which fundamentally alters the thermal properties. Thermosetting resins undergo irreversible curing to form a crosslinked network that can withstand high temperatures including reflow soldering conditions, while still allowing efficient molding processes, thereby resolving the contradiction between production efficiency and heat resistance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the production of optical components with enhanced mechanical strength, heat resistance, and mold transferability, suitable for high-functional optical devices, including those requiring reflow soldering, while maintaining a beautiful appearance and efficient production.
Implementation Method 1
a curable composition containing an epoxy compound (A), when subjected to cast molding, gives a molded article
Data Source
AI summary
Provided is a molded article that has such a shape as to offer a light condensing or light diffusing effect, has excellent mechanical strengths and heat resistance, and has a high thickness deviation ratio. This molded article includes a cured product of a curable composition containing an epoxy compound (A). The cured product has a flexural modulus of 2.5 GPa or more as measured in conformity with JIS K 7171:2008, except for performing measurement on a test specimen having a length of 20 mm, a width of 2.5 mm, and a thickness of 0.5 mm and at a span between specimen supports of 16 mm. The molded article has a thickness deviation ratio (thickest portion thickness to thinnest portion thickness ratio) of 5 or more and offers a light condensing or light diffusing effect. The molded article preferably has a thinnest portion thickness of 0.2 mm or less. The curable composition is preferably a photocurable composition.