Epoxy Resin Composition for Low-Roughness PCB Conductor Adhesion
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Solution Overview
Problem
Existing resin materials for printed wiring boards and semiconductor devices face challenges in achieving low roughness and excellent adhesion to conductors, as well as sufficient dielectric and heat resistance properties.
Innovation Solution
A resin composition comprising a naphthol aralkyl type epoxy resin with a weight-average molecular weight of 1,000 or more and an epoxy equivalent of 350 g/eq. or more, combined with an active ester type curing agent, which results in a cured product with improved conductor adhesion, low roughness, and enhanced dielectric and heat resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional resin compositions are used, then manufacturing process is simple, but conductor adhesion is insufficient and roughness is high
Solution Approach 1:
The patent changes the molecular weight parameter of the epoxy resin to 1,000 or more and the epoxy equivalent to 350 g/eq. or more, which fundamentally alters the resin's flow and curing characteristics to achieve both low roughness and excellent adhesion without complicating the manufacturing process
Solution Approach 2:
The patent creates a composite resin system combining high molecular weight naphthol aralkyl epoxy resin with specific curing agents, where the synergistic interaction between components achieves superior conductor adhesion and surface finish that neither component could achieve alone
2Reliability
If resin composition is optimized for adhesion, then conductor adhesion improves, but dielectric characteristics deteriorate
Solution Approach 1:
The patent carefully controls the epoxy equivalent parameter at 350 g/eq. or more, which balances the resin's polarity and molecular structure to maintain low dielectric loss while achieving high conductor adhesion through optimized crosslinking density
3Manufacturing precision
If resin composition is optimized for low roughness, then surface finish improves, but heat resistance deteriorates
Solution Approach 1:
The patent form a composite curing system that combines different curing mechanisms, where the primary curing agent provides low roughness through controlled surface curing, while secondary curing mechanisms maintain bulk heat resistance through extended crosslinking networks
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition produces a cured product with excellent conductor adhesion, low roughness, and superior dielectric and heat resistance properties, contributing to high functionality in printed wiring boards and semiconductor devices.
Implementation Method 1
a resin composition comprising (A) at least one naphthol aralkyl type epoxy resin having a weight-average molecular weight (Mw) of 1,000 or more and an epoxy equivalent of 350 g/eq. or more, and (B) at least one curing agent, wherein (B) the curing agent comprises (B-1) an active ester type curing agent
Data Source
AI summary
Resin compositions including: (A) a naphthol aralkyl type epoxy resin having a weight-average molecular weight (Mw) of 1,000 or more and an epoxy equivalent of 350 g/eq. or more; and (B) a curing agent, in which (B) the curing agent includes an active ester type curing agent are useful for preparing cured products, sheet lamination materials, resin sheets, printed wiring boards, and semiconductor devices, and for methods for producing printed wiring boards or semiconductor devices.