Epoxy Resin Composition for Printed Circuit Board Insulating Layer
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Solution Overview
Problem
Epoxy resin compositions used in printed circuit boards, particularly those with bisphenol A or F types, suffer from low viscosity, insufficient curing properties, mechanical strength, and limited thermal conductivity, which affect heat dissipation and reliability.
Innovation Solution
An epoxy resin composition incorporating a crystalline epoxy compound with a mesogen structure, diaminodiphenyl sulfone as a curing agent, and an inorganic filler, optimized in weight ratios to enhance thermal conductivity and glass transition temperature, is used in the insulating layer of printed circuit boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If bisphenol A type epoxy compound or bisphenol F type epoxy compound is used for the insulating layer, then the resin composition can be applied easily due to low viscosity, but the curing properties, mechanical strength, and toughness are insufficient
Solution Approach 1:
The patent combines multiple epoxy resin types (crystalline epoxy compound with mesogen structure, novolac resin, and bisphenol A or F type epoxy compound) to create a composite resin composition. This composite approach allows the system to simultaneously achieve good application properties from the low-viscosity components and enhanced mechanical strength, curing properties, and toughness from the crystalline epoxy compound and novolac resin.
Solution Approach 2:
The patent modifies the chemical structure parameters of the epoxy resin by introducing a crystalline epoxy compound with mesogen structure, which has specific molecular arrangements that enhance mechanical properties while maintaining processability. The controlled incorporation of this compound at specific concentrations changes the overall parameter profile of the resin composition.
2Reliability
If crystalline epoxy compound with mesogen structure, novolac resin and inorganic filler are used, then storage stability and curing properties are excellent, but thermal conductivity is limited
Solution Approach 1:
The patent creates a multi-component composite system combining crystalline epoxy compound, novolac resin, inorganic fillers (such as alumina, aluminum nitride, or boron nitride), and coupling agents. This composite structure integrates the storage stability and curing properties from the epoxy and novolac components with the thermal conductivity enhancement from the inorganic fillers, achieving a balanced performance profile.
Solution Approach 2:
The patent employs coupling agents as intermediary substances that facilitate the interaction between the organic resin matrix (epoxy compound and novolac resin) and the inorganic filler particles. These coupling agents improve the interfacial adhesion and thermal transfer efficiency, enabling the inorganic fillers to effectively enhance thermal conductivity while maintaining the structural integrity and stability provided by the resin system.
3Productivity
If electronic components with high concentration and higher capacity are mounted, then the circuit board functionality is enhanced, but heat dissipation becomes a concern
Solution Approach 1:
The patent converts the harmful heat generated by high-density electronic components into a manageable thermal field by incorporating thermally conductive inorganic fillers (alumina, aluminum nitride, boron nitride) into the insulating layer. These fillers act as heat sinks and thermal pathways, transforming the heat problem into an opportunity for enhanced thermal management and improved overall system reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves improved thermal resistance, glass transition temperature, and heat dissipation performance, enhancing the reliability and thermal management of printed circuit boards.
Implementation Method 1
the insulating layer having a high thermal resistance, glass transition temperature and thermal conductivity
Data Source
AI summary
An epoxy resin composition according to an embodiment of the present invention includes an epoxy compound, a curing agent including diaminodiphenyl sulfone, and an inorganic filler.