Epoxy Resin Composition for PCB Thermal Stability
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Solution Overview
Problem
Existing copper clad laminates face challenges in balancing heat resistance and moisture resistance, leading to issues like delamination and popcorn formation in multilayer printed circuit boards, while also requiring good dielectric properties and low thermal expansion.
Innovation Solution
An epoxy resin composition comprising 38-54 parts of an epoxy resin with a DCPD structure, 30-36 parts of an active ester curing agent, and 16-32 parts of a cyanate ester resin, which synergistically enhances glass transition temperature, reduces water absorption, and improves dielectric properties, achieving high heat and moisture resistance with low thermal expansion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If cyanate ester is used as a curing agent, then glass transition temperature is improved and dielectric properties are enhanced, but heat and moisture resistance becomes insufficient due to water absorption
Solution Approach 1:
The patent uses a composite curing system combining cyanate ester (16-32 parts) with active ester (30-36 parts) and epoxy resin (38-54 parts) to create a multi-component network structure. This composite approach allows the cyanate ester to provide high glass transition temperature and dielectric properties while the active ester and epoxy resin components compensate for moisture resistance deficiencies, preventing delamination and popcorn formation in multilayer PCBs.
2Productivity
If high wiring density and multilayer structure are implemented, then information transmission capacity is improved, but reliability deteriorates due to delamination and popcorn in high-frequency, high-temperature environments
Solution Approach 1:
The patent employs a composite resin system with epoxy resin containing DCPD structure (38-54 parts), active ester curing agent (30-36 parts), and cyanate ester resin (16-32 parts) to create a multi-phase network that simultaneously provides high dielectric performance for high-frequency signal transmission and excellent moisture resistance to prevent delamination and popcorn in multilayer PCB structures.
Solution Approach 2:
The patent optimizes the weight ratios of each component in the curing system, specifically controlling the cyanate ester content at 16-32 parts to balance dielectric properties and moisture resistance, while adjusting active ester (30-36 parts) and epoxy resin (38-54 parts) to achieve the desired crosslink density and network structure that prevents reliability issues in high-multilayer applications.
3Object-affected harmful factors
If flame retardants are added in large amounts, then flame resistance is improved, but heat resistance and dielectric properties deteriorate
Solution Approach 1:
The patent optimizes the chemical composition and crosslink density of the base resin system through precise control of cyanate ester (16-32 parts), active ester (30-36 parts), and epoxy resin (38-54 parts) ratios, creating a inherently flame-resistant network structure that achieves flame retardancy without requiring large amounts of flame retardant additives, thereby maintaining heat resistance and dielectric properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The epoxy resin composition results in printed circuit boards with high glass transition temperature, low water absorption, low dielectric loss, and excellent thermal stability, addressing the balance between heat and moisture resistance and dielectric performance.
Implementation Method 1
an epoxy resin composition comprising the following components: (A) from 38 to 54 parts by weight of an epoxy resin containing a DCPD structure; (B) from 30 to 36 parts by weight of an active ester curing agent; and (C) from 16 to 32 parts by weight of a cyanate ester resin
Data Source
AI summary
Provided are an epoxy resin composition and a prepreg, laminated board and printed-circuit board comprising same. The epoxy resin composition comprises the following components: (A) 38-54 parts by weight of an epoxy resin comprising a DCPD structure; (B) 30-36 parts by weight of an active ester curing agent; and (C) 16-32 parts by weight of a cyanate resin. With the mutual cooperation and synergistic facilitation effects of the particular contents of the three essential components, the epoxy resin composition is obtained. Under the premise of having a high resistance to heat and humidity and a high heat resistance at the same time, the prepreg, laminated board and printed-circuit board made of the epoxy resin composition further have a low thermal expansion coefficient, a low water absorption rate and excellent dielectric properties.