Epoxy Resin Composition for PCB Thermal Management

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Solution Overview

Problem

Printed circuit boards face limitations in thermal conduction due to the foam structure of existing heat dissipation sheets, which hinder effective heat dissipation from heating elements, necessitating a method to enhance thermal conductivity.

Innovation Solution

An epoxy resin composition incorporating a crystalline epoxy compound, a curing agent like diaminodiphenyl sulfone, and inorganic fillers such as boron nitride and aluminum oxide, optimized to improve thermal conductivity and heat dissipation performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If a foam structure heat dissipation sheet is used, then thermal insulation performance is improved, but thermal conduction function deteriorates

Engineering Contradiction:

Improvethermal insulationVSAvoidthermal conduction function

Core Design Contradiction:

Loss of energyVSReliability

Solution Approach 1:

The patent changes the fundamental parameter of the material structure from foam (porous) to dense solid structure. The epoxy resin composition is formulated to create a dense insulating layer without foam cells, eliminating the contradiction between insulation and conduction by changing the physical state parameter from cellular to solid continuous phase

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent uses composite materials by combining epoxy resin with high thermal conductivity fillers (boron nitride and aluminum oxide). This composite approach allows the material to simultaneously achieve good adhesion (from epoxy resin matrix) and high thermal conductivity (from filler particles), resolving the contradiction between insulation and conduction functions

Inventive Principle:

Principle #40Composite materials

2Reliability

If inorganic filler is added to improve thermal conductivity, then heat dissipation performance is improved, but manufacturing complexity increases

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidmanufacturing complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges multiple fillers (boron nitride and aluminum oxide) into a single composite filling system that can be processed together. The filling process combines particle dispersion and distribution in one manufacturing step, reducing overall complexity compared to sequential processing of separate filler types

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent avoids using porous foam structures and instead employs solid dense composite materials. This eliminates the need for complex foam formation processes, particle trapping in cells, and minimization techniques, thereby simplifying manufacturing while maintaining thermal performance

Inventive Principle:

Principle #31Porous materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The epoxy resin composition achieves high thermal conductivity and enhanced heat dissipation performance for printed circuit boards, improving reliability and thermal management.

Implementation Method 1

The inside of the foam structure is filled with an inorganic filler having good thermal conductivity... boron nitride (BN)... aluminum oxide

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

Heat emitted by the heating elements may degrade the performance of the printed circuit board... enhancing a thermal conduction effect... heat dissipation performance

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS9468096B2Epoxy resin composition, and printed circuit board using same

Publication Date: 2016.10.11 LG INNOTEK CO LTD

AI summary

According to one embodiment of the present invention, an epoxy resin composition comprises an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler includes boron nitride (BN).