Epoxy Resin Composition for Semiconductor Sealing
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Solution Overview
Problem
Epoxy resin compositions for encapsulating semiconductor devices face challenges in providing excellent heat dissipation and flexural strength while maintaining thermal conductivity, flowability, coefficient of thermal expansion, and moisture absorption rates, especially as semiconductor packages become lighter, thinner, and more densely stacked, leading to issues like warpage and package malfunction due to thermal expansion differences.
Innovation Solution
An epoxy resin composition incorporating nanomaterials with silicon (Si) and aluminum (Al), such as nanowires, nanorods, and nanotubes, along with traditional epoxy resins and curing agents, to enhance thermal conductivity and flexural strength without compromising flowability or moisture absorption, with specific formulations and ratios of Si to Al and pH control to optimize properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional epoxy resin composition is used for encapsulation, then basic protection is provided, but heat dissipation is insufficient leading to package malfunction and cracking
Solution Approach 1:
The patent uses a composite material system combining epoxy resin with specific inorganic fillers (alumina, silica, boron nitride) and nanomaterials (carbon nanotubes, graphene) to achieve both excellent heat dissipation and mechanical reliability. This composite approach allows the encapsulant to simultaneously conduct heat effectively while maintaining structural integrity under thermal stress.
Solution Approach 2:
The patent optimizes multiple parameters including filler particle size distribution (combining fine and coarse particles), filler content ratios (alumina 30-70 wt%, silica 10-40 wt%, boron nitride 5-20 wt%), and nanomaterial additions (0.1-5 wt% carbon nanotubes) to achieve the desired thermal conductivity (2-10 W/mK) while preventing package malfunction and cracking.
2Temperature
If inorganic fillers are added to improve thermal conductivity, then heat dissipation is enhanced, but flowability deteriorates
Solution Approach 1:
The patent applies local quality by using a bimodal or trimodal particle size distribution of inorganic fillers, combining fine particles (0.1-10 μm) that improve flowability with coarse particles (10-100 μm) that enhance thermal conductivity. This allows different regions of the filler spectrum to serve different functions, resolving the contradiction between flowability and thermal performance.
Solution Approach 2:
The combination of multiple types of inorganic fillers (alumina, silica, boron nitride) with different thermal conductivities and particle characteristics creates a composite filler system that balances flowability and thermal conductivity. The diverse particle morphology and composition allow the mixture to flow well while providing excellent heat dissipation pathways.
3Weight of moving object
If package is made light, thin and miniaturized to meet portable device requirements, then device compactness is improved, but warpage occurs due to coefficient of thermal expansion difference
Solution Approach 1:
The patent modifies the coefficient of thermal expansion (CTE) of the epoxy encapsulant by adjusting the composition and content of inorganic fillers. By incorporating high-CTE fillers like alumina and silica in specific ratios (30-70 wt% and 10-40 wt% respectively), the overall CTE of the composite is tuned to better match that of the semiconductor chip, reducing thermal mismatch stress and preventing warpage in thin, miniaturized packages.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves excellent heat dissipation, flexural strength, and resistance to thermal shock while maintaining flowability and moisture absorption rates, improving the reliability and performance of semiconductor devices by balancing thermal conductivity and mechanical properties.
Implementation Method 1
the inorganic fillers include nanomaterials containing silicon (Si) and aluminum (Al)... the nanomaterials may have a thermal conductivity of 5 W/mK to 30 W/mK... exhibits excellent thermal conductivity
Implementation Method 2
exhibits excellent thermal conductivity without suffering deterioration in flowability, coefficient of thermal expansion, flexural modulus, and moisture absorption rate
Data Source
AI summary
An epoxy resin composition for sealing a semiconductor device, of the present invention, contains an inorganic filler, and the inorganic filler contains a nanomaterial containing silicon (Si) and aluminium (Al).