Liquid Epoxy Resin Composition for Semiconductor Sealing
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Solution Overview
Problem
Semiconductor devices face challenges with warpage due to thermal expansion differences between silicon and thermosetting resins, leading to manufacturing issues, and high compressive stress during curing, especially with larger wafers, which causes peeling and damage during polishing.
Innovation Solution
A liquid epoxy resin composition with a surface-treated spherical inorganic filler and specific additives is used for semiconductor sealing, providing excellent fluidity, reduced warpage, and improved polishability, allowing for reliable curing and heat resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thermosetting resin is used to seal a large-diameter wafer, then the sealing and molding can be performed, but large warpage occurs due to difference in coefficient of thermal expansion between silicon and the thermosetting resin
Solution Approach 1:
The patent modifies the chemical composition parameters of the epoxy resin by incorporating specific additives (silane-modified epoxy resin, polyester-modified epoxy resin, and rubber-modified epoxy resin) to change the coefficient of thermal expansion and curing characteristics of the resin, thereby reducing warpage while maintaining sealing reliability
Solution Approach 2:
The patent creates a composite resin system by combining multiple types of epoxy resins with different functional properties (silane-modified for adhesion, polyester-modified for flexibility, rubber-modified for stress relief) to achieve both low warpage and high reliability
2Productivity
If the diameter of the wafer is increased to at least 30.48 cm (12 inches), then mass production can be enabled, but the compressive stress of the epoxy resin after sealing becomes so high as to cause peeling of the semiconductor element from the substrate
Solution Approach 1:
The patent changes the mechanical properties of the resin by incorporating rubber-modified epoxy resin and controlling the filler content, which reduces the compressive stress and improves adhesion strength, enabling stable bonding on large-diameter wafers for mass production
Solution Approach 2:
The silane-modified epoxy resin acts as an intermediary between the filler particles and the base resin, improving stress distribution and adhesion, thereby preventing peeling while maintaining the structural integrity required for large-wafer processing
3Weight of moving object
If a sealing layer with filler loading of at least 90% by weight is used to thin the semiconductor device through polishing, then device thinning can be achieved, but a blade of a dicing apparatus is liable to be damaged and the frequency of replacement of the blade is high
Solution Approach 1:
The patent optimizes the filler particle size distribution and surface treatment parameters to create a sealing layer that is both thin and easy to polish, reducing blade damage while achieving the required device thinning
Solution Approach 2:
The patent applies surface treatment to the filler particles to modify local properties of the sealing layer, improving polishability and reducing blade damage in high-stress areas during the polishing process
4Weight of moving object
If polishing is conducted at enhanced polishing pressure to process the sealing layer, then device thinning can be achieved, but damaging of the semiconductor elements or cracking of the wafer itself occurs
Solution Approach 1:
The patent modifies the resin composition to reduce curing shrinkage and improve flexibility, allowing polishing to be conducted at lower pressures without compromising element integrity or causing wafer cracking
Solution Approach 2:
The rubber-modified epoxy resin provides beforehand cushioning by absorbing stress during polishing, preventing damage to semiconductor elements and cracking of the wafer under enhanced polishing pressure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition ensures minimal warpage and enhanced reliability of semiconductor devices, enabling efficient processing and dicing of large-diameter wafers with reduced peeling and cracking, and improved humidity resistance.
Implementation Method 1
a surface-treated spherical inorganic filler which is a spherical inorganic filler having an average particle diameter of 0.1 to 10 μm as measured by a laser diffraction method and serving as an inorganic filler, the surface of the spherical inorganic filler being surface-treated with 0.5 to 2.0 parts by weight of a (meth)acrylic functional silane coupling agent
Implementation Method 2
A liquid epoxy resin composition for semiconductor sealing, including: (A) a liquid epoxy resin that does not include a siloxane bond in its molecule; (B) an acid anhydride curing agent
Data Source
Figure 1
AI summary
The present invention relates to a liquid epoxy resin composition for semiconductor sealing, which contains: (A) a liquid epoxy resin that does not contain a siloxane bond in each molecule; (B) an acid anhydride-based curing agent; (C) a surface-treated spherical inorganic filler which is a spherical inorganic filler having an average particle diameter of 0.1-10 µm as determined by a laser diffraction method and serving as an inorganic filler, and wherein the surface of the spherical inorganic filler is surface-treated with 0.5-2.0 parts by weight of a (meth)acrylic functional silane coupling agent per 100 parts by weight of the spherical inorganic filler of the component (C); and (D) a curing accelerator. The present invention is able to provide a semiconductor device which has excellent heat resistance and moisture resistance.