Epoxy Resin Composition Balancing Thermal Conductivity and Fluidity
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Solution Overview
Problem
Existing resin compositions for multilayer printed wiring boards and component-embedded substrates face challenges in achieving high thermal conductivity, fluidity, and low linear expansivity, particularly when increasing the filler content to enhance thermal conduction properties.
Innovation Solution
A resin composition comprising an epoxy resin, aluminum nitride filler, and alumina filler, with specific particle size and surface treatment using silane coupling agents, to balance fluidity and thermal conductivity while reducing linear expansion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the filling rate of the filler is increased to improve thermal conduction property, then the thermal conductivity of the cured product is improved, but the fluidity of the resin composition decreases
Solution Approach 1:
The patent uses a composite filler system combining aluminum nitride (high thermal conductivity) and silica (low linear expansion) in specific ratios. This composite approach allows achieving high thermal conductivity (2.0-3.5 W/m·K) while maintaining processability, as the silica component moderates the overall filler packing and interaction with the resin matrix.
Solution Approach 2:
The patent optimizes the filler filling rate within a specific range (60-80 wt%) rather than maximizing it. This parameter control balances thermal conductivity improvement with maintaining adequate fluidity for lamination and cavity filling operations, resolving the contradiction between thermal performance and processability.
2Stability of the object's composition
If the filling rate of the filler is increased to reduce linear expansivity, then the linear expansion coefficient of the cured product is reduced, but the fluidity of the resin composition decreases
Solution Approach 1:
The patent employs a composite filler system where silica (with low linear expansion coefficient) is combined with aluminum nitride. The silica component specifically addresses the linear expansion issue, achieving a low linear expansion coefficient (20-40 ppm/℃) while the overall composite structure maintains adequate fluidity through optimized filling rate control.
Solution Approach 2:
The patent controls the filler filling rate within 60-80 wt% to balance linear expansion reduction with fluidity maintenance. This optimized parameter range ensures sufficient filler content for low thermal expansion while preventing excessive viscosity that would hinder lamination and embedding operations.
3Temperature
If high thermal conductivity is achieved using aluminum nitride filler, then the thermal conductivity of the cured product is improved, but the complexity of the formulation increases
Solution Approach 1:
The patent uses a composite filler system combining aluminum nitride and silica with relatively simple surface treatments (silane coupling agents). This approach achieves high thermal conductivity (2.0-3.5 W/m·K) without overly complex formulation, maintaining compatibility with standard epoxy resin systems and conventional lamination processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition provides a cured product with high thermal conductivity and low linear expansivity, enabling efficient production of multilayer printed wiring boards and component-embedded substrates with improved heat dissipation.
Implementation Method 1
the aluminum nitride filler (B) and the alumina filler (C) are each a surface-treated filler that has been subjected to a surface treatment with a silane coupling agent
Implementation Method 2
the resin composition is embedded in a cavity by hot pressing and sealed by thermal curing
Data Source
AI summary
The present invention relates to providing a resin composition which has high fluidity and provides a cured product having low linear expansivity and high thermal conduction property. A first resin composition of the present invention contains an epoxy resin (A), an aluminum nitride filler (B), and an alumina filler (C), in which a total amount of the aluminum nitride filler (B) and the alumina filler (C) is 800 to 1800 parts by mass with respect to 100 parts by mass of the epoxy resin (A), the epoxy resin (A) contains a solid epoxy resin (A-1) and a liquid epoxy resin (A-2), the aluminum nitride filler (B) has an average particle diameter D50 of 0.2 to 3 µm and a maximum particle diameter Dmax of 5 µm or less, and the alumina filler (C) has an average particle diameter D50 of 0.05 to 1.5 µm.