Epoxy Resin Thermal Interface Materials with High Conductivity
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Solution Overview
Problem
Current thermal interface materials face challenges in achieving high thermal conductivity while maintaining mechanical properties due to the high percentage of thermally conductive powders required, which often deteriorate the resin composition's characteristics such as softness and mechanical strength.
Innovation Solution
An epoxy resin composition is developed, comprising a specific ratio of aromatic epoxy resins and amino compounds, along with a thermal conductive filler, to enhance thermal conductivity and mechanical properties, with the filler content limited to less than 50% by weight.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the amount of thermally conductive powder is increased to improve thermal conductivity, then thermal conductivity value gets higher, but mechanical strength and softness deteriorate
Solution Approach 1:
The patent uses a composite material system consisting of thermally conductive powder particles dispersed in an epoxy resin matrix. This composite structure allows the material to combine the high thermal conductivity of the powder fillers with the mechanical strength and binding properties of the resin, resolving the contradiction between thermal performance and mechanical properties
Solution Approach 2:
The patent optimizes the weight percentage of thermally conductive powder within a specific range (60-80 wt%) rather than using excessive amounts. This parameter optimization ensures sufficient thermal conductivity while maintaining adequate mechanical strength and softness, preventing the deterioration of resin characteristics
2Temperature
If the amount of thermally conductive powder is increased to improve thermal conductivity, then thermal conductivity value gets higher, but softness deteriorates
Solution Approach 1:
The epoxy resin matrix in the composite material provides the necessary softness and flexibility to the thermal interface material, compensating for the rigidity introduced by thermally conductive powder particles. This composite structure maintains both thermal conductivity and operational softness
Solution Approach 2:
By controlling the powder content within 60-80 wt% and selecting appropriate resin formulations, the patent achieves an optimal balance where the material remains sufficiently soft for application while providing high thermal conductivity, preventing excessive hardening
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The epoxy resin composition achieves high thermal conductivity (above 0.3 W/mK) and insulating properties while maintaining mechanical strength, as demonstrated by the thermal interface materials' tested properties.
Implementation Method 1
high-thermal-conductive powder capable of improving thermal conductivity, for example ceramic powder such as aluminum oxide or boron nitride is added thereto
Data Source
AI summary
An epoxy resin composition is provided. The epoxy resin composition includes a first aromatic epoxy resin represented by formula (I), and an amino compound selected from a group that includes 4,4'-methylenedianiline, 4,4'-ethylenedianiline, 4,4'-bis(4-aminophenoxy)biphenyl and 1,4-bis(4-aminophenoxy)benzene, wherein the ratio between the epoxy groups of the first aromatic epoxy resin and the amino groups of the amino compound ranges from 1:1 to 2:1.