Epoxy Resin Composition for Underfill with Microcapsular Curing Agent
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Solution Overview
Problem
Current epoxy resin compositions for underfill materials face challenges in achieving low viscosity for better permeation, sufficient curability at around 100°C, and high storage stability, while also maintaining stability during the film production process and in the film state.
Innovation Solution
The epoxy resin composition includes a combination of epoxy resin, microcapsular curing agent, reactive diluent, and a specific compound represented by formula (1), with the microcapsular curing agent having a core circularity of 0.93 or more and the reactive diluent being a monofunctional compound with an aromatic ring, optimizing the balance between viscosity, curability, and storage stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a one-component epoxy resin composition is used to omit mixing process, then productivity is improved, but storage stability deteriorates due to integration of epoxy resin and curing agent
Solution Approach 1:
The curing agent is segmented into microcapsules with core-shell structure, separating the reactive curing agent from the epoxy resin while maintaining a one-component system. The microcapsules contain the curing agent in a dormant state that activates only upon contact with moisture from the epoxy resin or during curing, thus improving storage stability while maintaining productivity benefits.
Solution Approach 2:
A shell material acts as an intermediary between the curing agent core and the external environment, controlling the release and activation of the curing agent. The shell protects the curing agent during storage while allowing controlled interaction during application, resolving the contradiction between storage stability and reactivity.
2Reliability
If low viscosity is achieved for sufficient permeation, then gap permeability is improved, but curability at low temperature deteriorates
Solution Approach 1:
The viscosity of the epoxy resin composition is optimized to a specific range (10-1000 cP at 25°C) that balances permeation capability and curability. This parameter optimization ensures sufficient gap permeability while maintaining adequate curability at low temperatures (around 100°C) by preventing excessive dilution that would compromise the curing reaction.
3Stability of the object's composition
If microcapsular curing agent with high core circularity is used, then storage stability is improved, but manufacturing complexity increases
Solution Approach 1:
The core circularity of the microcapsules is optimized to a specific range (0.93 or more) that provides sufficient storage stability without excessive manufacturing complexity. This parameter optimization balances the need for stable microcapsule structure with practical manufacturing considerations, avoiding overly complex production processes while achieving the desired stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves low viscosity, sufficient curability at 100°C, and excellent storage stability, ensuring stability during film production and in the film state, making it suitable for underfill materials and other applications requiring rapid permeation and uniform curing.
Implementation Method 1
wherein the microcapsular curing agent has a core circularity of 0.93 or more
Implementation Method 2
the reactive diluent being a monofunctional compound with an aromatic ring
Implementation Method 3
a compound represented by formula (1): wherein X1 has 2 or more and 5 or less consecutive carbon-carbon bonds
Data Source
AI summary
The present invention provides an epoxy resin composition containing:a component (A): epoxy resin;a component (B): microcapsular curing agent;a component (C): reactive diluent; anda component (D): compound represented by formula (1) below:wherein X1 has 2 or more and 5 or less consecutive carbon-carbon bonds, and a substituent of carbon contained in X1 and R1 to R5 are each one selected from the group consisting of hydrogen, an alkyl group, an unsaturated aliphatic group, an aromatic group, a heteroatom-containing substituent, a halogen atom-containing substituent, and a halogen atom; the substituent of carbon contained in X1 and R1 to R5 are the same as or different from each other; and the compound is optionally a fused ring compound in which any of R1 to R5 are present in the same ring.