Epoxy Resin Composition Viscosity Control for Prepregs

The patent applies parameter changes by modifying the chemical composition parameters of the resin system. Specifically, it changes the epoxy resin type (using low-viscosity variants), adjusts the curing agent selection and ratio, and optimizes the filler particle size distribution. These parameter modifications enable the resin to maintain appropriate viscosity at room temperature for good workability while developing higher viscosity at curing temperature to suppress resin flow and ensure thickness uniformity.

The patent employs composite materials by creating a multi-component resin system that combines epoxy resin with specific curing agents and fillers. This composite approach allows the system to exhibit different rheological properties at different temperatures - the combination of components works synergistically to provide low viscosity at room temperature for ease of handling while achieving high viscosity during curing to prevent resin loss and maintain thickness uniformity.

The patent uses parameter changes to achieve controlled resin viscosity during curing. By selecting specific epoxy resin types with appropriate molecular weights, optimizing the curing agent ratio, and adjusting filler content and particle size, the resin system achieves sufficiently high viscosity at curing temperature to prevent excessive flow and resin loss while still allowing complete curing to occur. This parameter optimization ensures both curing completion and thickness uniformity.

The patent references and builds upon known resin systems and curing formulations, adapting proven compositions to achieve the desired viscosity characteristics. By copying successful formulations from prior art and making targeted adjustments to resin type, curing agent selection, and filler properties, the patent achieves reliable curing completion without the resin loss and thickness unevenness problems associated with conventional compositions.