Epoxy-Resin Composition for Void-Suppressed Tough FRP Prepregs

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Solution Overview

Problem

Existing epoxy-resin compositions for fiber-reinforced plastics face challenges in achieving rapid curing at low temperatures, maintaining storage stability, and preventing voids in molded products, while also requiring improved fracture toughness and heat tolerance.

Innovation Solution

An epoxy-resin composition comprising specific components such as an epoxy resin with an oxazolidone-ring structure, a bisphenol bifunctional epoxy resin, a triblock copolymer, and a curing agent like dicyandiamide, which allows for faster curing at lower temperatures, enhanced processability, and improved mechanical properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a highly reactive epoxy-resin composition is used to shorten curing time, then curing speed is improved, but storage stability deteriorates due to spontaneous curing at room temperature

Engineering Contradiction:
Improvecuring speedVSAvoidstorage stability
Core Design Contradiction:
ProductivityVSStability of the object's composition

Solution Approach 1:

A silane-modified epoxy resin is introduced as an intermediary component that reacts with the base epoxy resin to form a modified resin composition. This intermediary substance enables rapid curing when activated while maintaining storage stability in its unactivated state, effectively mediating between the conflicting requirements of fast curing and stable storage.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The chemical structure of the epoxy resin is modified by introducing silane groups, which changes the reactivity parameters of the resin. The silane-modified epoxy resin has different reaction characteristics compared to conventional epoxy resins, allowing for controlled rapid curing under specific conditions while maintaining stability during storage through parameter optimization.

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If the matrix resin viscosity is lowered to suppress voids in molded products, then void formation is reduced, but prepreg handleability deteriorates due to excessive tackiness at room temperature

Engineering Contradiction:
Improvevoid suppressionVSAvoidprepreg handleability
Core Design Contradiction:
Manufacturing precisionVSEase of operation

Solution Approach 1:

The matrix resin is formulated as a composite system combining base epoxy resin, silane-modified epoxy resin, and polyvinyl formal. This composite material composition achieves optimal balance between viscosity and tackiness, where the silane-modified component contributes to void suppression while the polyvinyl formal provides controlled adhesion, resolving the contradiction between void suppression and handleability.

Inventive Principle:
Principle #40Composite materials

3Stability of the object's composition

If conventional epoxy-resin compositions are used to maintain storage stability, then storage stability is preserved, but curing time increases and fracture toughness remains insufficient

Engineering Contradiction:
Improvestorage stabilityVSAvoidcuring time
Core Design Contradiction:
Stability of the object's compositionVSProductivity

Solution Approach 1:

The silane modification of the epoxy resin is performed in advance during resin formulation, creating a pre-modified resin that is stable during storage but capable of rapid curing when activated. This preliminary chemical modification enables the resin to maintain stability during storage while being prepared for fast curing performance when needed.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

A composite resin system is created combining base epoxy resin with silane-modified epoxy resin and polyvinyl formal. This composite formulation achieves both long-term storage stability and rapid curing capability, while also improving fracture toughness through the synergistic effects of the different components.

Inventive Principle:
Principle #40Composite materials

4Productivity

If a prepreg is designed for rapid low-temperature curing to reduce molding time, then productivity is improved, but the resin composition becomes too reactive causing spontaneous curing during storage

Engineering Contradiction:
Improvemolding speedVSAvoidstorage stability
Core Design Contradiction:
ProductivityVSStability of the object's composition

Solution Approach 1:

The silane-modified epoxy resin acts as an intermediary that decouples the reactivity required for fast curing from the stability required for storage. The modification creates a resin that remains stable during storage but can be rapidly activated for curing, enabling high productivity without sacrificing storage stability.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition enables the production of fiber-reinforced plastics with excellent fracture toughness, heat tolerance, and reduced voids, while maintaining processability at room temperature and reducing curing time, thus addressing the limitations of previous technologies.

Implementation Method 1

a silane-modified epoxy resin, which undergoes a curing reaction with a base epoxy resin upon contact

Methodology Applied
Scientific EffectCuring reaction: Chemical Bonding

Implementation Method 2

curing reactions progress even when the composition is stored at room temperature

Methodology Applied
Scientific EffectAbsorption: Absorption (physical)

Data Source

PatentUS9988508B2Epoxy-resin composition and film, prepreg, and fiber-reinforced plastic using same
Publication Date: 2018.06.05 MITSUBISHI CHEM CORP

AI summary

An epoxy-resin composition of the components (A), (B), (D) and (E), where component (A) is an epoxy resin having an oxazolidone-ring structure, (B) is a bisphenol bifunctional epoxy resin with a number-average molecular weight of at least 600 but no more than 1300, which does not have an oxazolidone-ring structure, (D) is a triblock copolymer, and (E) is a curing agent. A film made of the epoxy-resin composition, a prepreg and a fiber-reinforced plastic is also disclosed. The epoxy resin composition is capable of achieving both a processability of a prepreg at room temperature and a suppression of voids in the molded product. A fiber-reinforced plastic having excellent mechanical properties, especially excellent fracture toughness and heat tolerance, is also obtained by using the epoxy-resin composition.