Epoxy Resin Composition for Silicon Wafer Dicing
Solution Overview
Problem
Existing epoxy resin compositions face challenges in achieving uniform thickness and smoothness when applied to large-diameter silicon wafers, leading to surface irregularities and difficulties in forming individual chips with good dicing properties.
Innovation Solution
A resin composition comprising a solid epoxy resin with a specific softening point, a curing agent, a curing accelerator, an inorganic filler, a diluent, and dimethyl silicone, which can be easily B-staged by heating, providing excellent bonding to dicing tapes and superior dicing properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If conventional epoxy resin compositions are printed across a larger surface area, then coating coverage is improved, but surface irregularities are formed and uniform thickness cannot be achieved
Solution Approach 1:
The patent modifies the physical and chemical parameters of the epoxy resin composition, specifically adjusting the softening point to 40-110°C and incorporating dimethyl silicone (0.01-2 parts by mass per 100 parts of epoxy resin + curing agent), to achieve optimal printability and surface smoothness across large areas
Solution Approach 2:
The patent creates a composite material system combining epoxy resin, curing agent, curing accelerator, inorganic filler (mass-average particle size 0.05-5 μm), diluent, and dimethyl silicone. This composite formulation works synergistically to provide both large-area coverage capability and uniform surface thickness
2Volume of moving object
If the epoxy resin composition is made thinner to meet reduction demands, then package thickness is reduced, but bonding performance and dicing properties deteriorate
Solution Approach 1:
The patent optimizes the softening point parameter of the epoxy resin to 40-110°C, which allows the composition to maintain excellent bonding performance and dicing properties even at reduced thicknesses of several μm to several dozen μm
Solution Approach 2:
The patent incorporates dimethyl silicone (0.01-2 parts by mass per 100 parts of epoxy resin + curing agent) to provide local quality enhancement at the surface, achieving smoothness and excellent bonding without increasing overall thickness
3Temperature
If the softening point of epoxy resin is increased to improve heat resistance, then thermal stability is improved, but printability and surface smoothness deteriorate
Solution Approach 1:
The patent identifies and optimizes the softening point parameter to a specific range of 40-110°C, which represents the optimal balance point between heat resistance and printability, resolving the contradiction between these two opposing requirements
Solution Approach 2:
The patent introduces dimethyl silicone as an intermediary substance that mediates between the epoxy resin matrix and the printing process, enabling smooth surface formation and good printability while maintaining the heat resistance provided by the epoxy resin system
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves smooth printing, uniform thickness, and excellent bonding to dicing tapes, enabling efficient dicing of silicon wafers into individual chips with improved thermal cycling resistance and die bonding performance.
Implementation Method 1
a diluent, in an amount of 5 to 400 parts by mass per 100 parts by mass of the combination of the component (A) and the component (B), and (F) a dimethyl silicone
Implementation Method 2
can be easily B-staged by heating
Implementation Method 3
in a B-stage state, exhibited excellent bonding to dicing tapes
Data Source
AI summary
An epoxy resin composition including (A) an epoxy resin that is solid at room temperature and has a softening point of 40° C. to 110° C., (B) a curing agent that is solid at room temperature and has a softening point of not less than 40° C. to 110° C., (C) a curing accelerator, (D) an inorganic filler having a mass-average particle size of 0.05 to 5 μm, (E) a diluent, and (F) a specific dimethyl silicone, in which at least one of the component (A) and the component (B) is silicone-modified is provided. The composition can be used in a silicon chip die attach method or to produce a semiconductor device containing a silicon chip, a substrate and a cured product of the composition, in which the silicon chip is bonded to the substrate via the cured product.